{"id":37668,"date":"2026-05-05T09:34:16","date_gmt":"2026-05-05T09:34:16","guid":{"rendered":"https:\/\/mascherpa.it\/?p=37668"},"modified":"2026-05-05T09:37:01","modified_gmt":"2026-05-05T09:37:01","slug":"37668","status":"publish","type":"post","link":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/","title":{"rendered":"Low Pressure Molding: SIPOL and TECNO INCOLLAGGI together with Mascherpa at Focus on PCB."},"content":{"rendered":"[vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; bg_color=&#8221;#f7f7f7&#8243; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;15px&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;clip-path&#8221; clip_path_animation_type=&#8221;default&#8221; clip_path_animation_applies=&#8221;default&#8221; clip_path_animation_addon=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;padding-3-percent&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221; column_padding_type=&#8221;default&#8221; gradient_type=&#8221;default&#8221;][vc_row_inner column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; text_align=&#8221;left&#8221; row_position=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; pointer_events=&#8221;all&#8221;][vc_column_inner column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; overflow=&#8221;visible&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221; column_padding_type=&#8221;default&#8221; gradient_type=&#8221;default&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h2 class=\"p3\">Key points of the article<\/h2>\n[\/vc_column_text]<div class=\"nectar-fancy-ul\" data-list-icon=\"icon-salient-check\" data-animation=\"true\" data-animation-delay=\"0\" data-color=\"accent-color\" data-spacing=\"default\" data-alignment=\"left\"> \n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">The partnership between <\/span><b>Mascherpa<\/b><span style=\"font-weight: 400;\">, <\/span><b>SIPOL<\/b><span style=\"font-weight: 400;\"> and <\/span><b>TECNO INCOLLAGGI<\/b><span style=\"font-weight: 400;\"> introduces a complete <\/span><b>system<\/b><span style=\"font-weight: 400;\"> for <\/span><b>electronic encapsulation<\/b><span style=\"font-weight: 400;\"> based on <\/span><b>Low Pressure Molding<\/b><span style=\"font-weight: 400;\">.<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">The <\/span><b>LPM<\/b><span style=\"font-weight: 400;\"> process enables <\/span><b>PCB protection<\/b><span style=\"font-weight: 400;\"> and <\/span><b>sensitive components<\/b><span style=\"font-weight: 400;\"> through <\/span><b>molding<\/b><span style=\"font-weight: 400;\"> at <\/span><b>low pressure<\/b><span style=\"font-weight: 400;\"> without damaging them.<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">The <\/span><b>e-TECHNIPOL\u00ae<\/b><span style=\"font-weight: 400;\"> materials ensure <\/span><b>protection<\/b><span style=\"font-weight: 400;\"> from external agents, <\/span><b>chemical resistance<\/b><span style=\"font-weight: 400;\"> and <\/span><b>mechanical stability<\/b><span style=\"font-weight: 400;\"> over time.<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">The <\/span><b>Tecnostar Overmolding<\/b><span style=\"font-weight: 400;\"> system enables precise <\/span><b>control<\/b><span style=\"font-weight: 400;\"> of the <\/span><b>process<\/b><span style=\"font-weight: 400;\">, waste reduction and <\/span><b>consistent quality<\/b><span style=\"font-weight: 400;\"> of the product.<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\">The technology will be presented at <b>Focus on PCB 2026<\/b>, where it will be possible to see the process applied and explore the applications.<\/li>\n<\/ul>\n <\/div>[\/vc_column_inner][\/vc_row_inner][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][divider line_type=&#8221;No Line&#8221; custom_height=&#8221;30&#8243;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\">At  <\/span><a href=\"https:\/\/mascherpa.it\/en\/blog\/hot-melt-adhesives-for-packaging-and-labeling-2-2-2\/\"><b>Focus on PCB 2026<\/b><\/a><span style=\"font-weight: 400;\">,  <\/span><b>Mascherpa<\/b><span style=\"font-weight: 400;\">  presents the partnership with  <\/span><a href=\"https:\/\/sipol.com\/it\/\"><b>SIPOL<\/b><\/a><span style=\"font-weight: 400;\">  e  <\/span><a href=\"https:\/\/tecnoincollaggi.it\/\"><b>TECNO INCOLLAGGI<\/b><\/a><span style=\"font-weight: 400;\">  to introduce a complete  <\/span><b>system<\/b><span style=\"font-weight: 400;\">  of  <\/span><b>encapsulation<\/b><span style=\"font-weight: 400;\">  based on  <\/span><b>technology<\/b><span style=\"font-weight: 400;\">  of  <\/span><b>Low Pressure Molding<\/b><span style=\"font-weight: 400;\">  (<\/span><b>LPM<\/b><span style=\"font-weight: 400;\">).<\/span><\/p>\n<p><span style=\"font-weight: 400;\">The objective of the partnership is to deliver an <\/span><b>integrated approach<\/b><span style=\"font-weight: 400;\"> that combines:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>high-performance hot melt<\/b><span style=\"font-weight: 400;\"> materials,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>low-pressure molding<\/b><span style=\"font-weight: 400;\"> process,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>control of process <\/b><span style=\"font-weight: 400;\">parameters.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">A <\/span><b>solution<\/b><span style=\"font-weight: 400;\"> designed to ensure <\/span><b>protection<\/b><span style=\"font-weight: 400;\">, <\/span><b>stability<\/b><span style=\"font-weight: 400;\"> and consistent <\/span><b>quality<\/b><span style=\"font-weight: 400;\"> in <\/span><b>electronic encapsulation<\/b><span style=\"font-weight: 400;\"> processes for <\/span><b>PCBs<\/b><span style=\"font-weight: 400;\">.<\/span>[\/vc_column_text][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; bg_color=&#8221;#f7f7f7&#8243; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;15px&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;clip-path&#8221; clip_path_animation_type=&#8221;default&#8221; clip_path_animation_applies=&#8221;default&#8221; clip_path_animation_addon=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;padding-3-percent&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221; column_padding_type=&#8221;default&#8221; gradient_type=&#8221;default&#8221;][vc_row_inner column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; text_align=&#8221;left&#8221; row_position=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; pointer_events=&#8221;all&#8221;][vc_column_inner column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; overflow=&#8221;visible&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221; column_padding_type=&#8221;default&#8221; gradient_type=&#8221;default&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h2 class=\"p3\">Index<\/h2>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><a href=\"#1\"><span style=\"font-weight: 400;\">What is Low Pressure Molding<\/span><\/a><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><a href=\"#2\"><span style=\"font-weight: 400;\">Low Pressure Molding VS Traditional Potting<\/span><\/a><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><a href=\"#3\"><span style=\"font-weight: 400;\">e-TECHNIPOL\u00ae materials for electronic encapsulation<\/span><\/a>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"2\"><a href=\"#4\"><span style=\"font-weight: 400;\">Characteristics of e-TECHNIPOL\u00ae products used in Low Pressure Molding<\/span><\/a><\/li>\n<\/ul>\n<\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><a href=\"#5\"><span style=\"font-weight: 400;\">TECNO INCOLLAGGI: Low Pressure Molding process control<\/span><\/a>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"2\"><a href=\"#6\"><span style=\"font-weight: 400;\">What the Tecnostar system guarantees<\/span><\/a><\/li>\n<\/ul>\n<\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><a href=\"#7\"><span style=\"font-weight: 400;\">An integrated system: material and process in a single solution<\/span><\/a><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><a href=\"#8\"><span style=\"font-weight: 400;\">Focus on PCB 2026: Low Pressure Molding technology at the trade show<\/span><\/a><\/li>\n<\/ul>\n[\/vc_column_text][\/vc_column_inner][\/vc_row_inner][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; id=&#8221;1&#8243; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h2><strong>What is Low Pressure Molding<\/strong><\/h2>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\"><\/span><b>Low Pressure Molding<\/b><span style=\"font-weight: 400;\"> is an <\/span><b>encapsulation technology<\/b><span style=\"font-weight: 400;\"> that enables the protection of <\/span><b>electronic components<\/b><span style=\"font-weight: 400;\">, such as <\/span><b>PCBs<\/b><span style=\"font-weight: 400;\"> and <\/span><b>connectors<\/b><span style=\"font-weight: 400;\">, through <\/span><b>molding<\/b><span style=\"font-weight: 400;\"> at <\/span><b>low pressure<\/b><span style=\"font-weight: 400;\"> that does not damage sensitive parts.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">The process is based on the use of <\/span><b>single-component thermoplastic adhesives<\/b><span style=\"font-weight: 400;\"> that are:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>melted<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>injected<\/b><span style=\"font-weight: 400;\"> into the <\/span><b>mold<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>solidified<\/b> directly <b>on the component<\/b>.<\/li>\n<\/ul>\n[\/vc_column_text][image_with_animation image_url=&#8221;37194&#8243; image_size=&#8221;full&#8221; max_width=&#8221;custom&#8221; animation_type=&#8221;entrance&#8221; animation=&#8221;None&#8221; animation_movement_type=&#8221;transform_y&#8221; hover_animation=&#8221;none&#8221; alignment=&#8221;&#8221; border_radius=&#8221;none&#8221; box_shadow=&#8221;none&#8221; image_loading=&#8221;default&#8221; max_width_custom=&#8221;40%&#8221;][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; id=&#8221;2&#8243; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h2 class=\"p4\"><strong>Low Pressure Molding VS Traditional Potting<\/strong><\/h2>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\">Compared to <\/span><b>traditional systems<\/b><span style=\"font-weight: 400;\"> of <\/span><b>potting<\/b><span style=\"font-weight: 400;\"> or <\/span><b>two-component casting<\/b><span style=\"font-weight: 400;\">, <\/span><b>Low Pressure Molding<\/b><span style=\"font-weight: 400;\"> enables:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">a <\/span><b>faster<\/b><span style=\"font-weight: 400;\"> <\/span><b>production cycle<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">a significant <\/span><b>reduction<\/b><span style=\"font-weight: 400;\"> in <\/span><b>material used<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">a <\/span><b>lower weight<\/b><span style=\"font-weight: 400;\"> of the final component,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">the elimination, in some cases, of structural elements such as the housing.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">The reduction in <\/span><b>process pressures<\/b><span style=\"font-weight: 400;\"> also enables the use of <\/span><b>aluminum molds<\/b><span style=\"font-weight: 400;\">, with advantages in terms of <\/span><b>thermal control<\/b><span style=\"font-weight: 400;\"> and <\/span><b>production costs<\/b><span style=\"font-weight: 400;\">.<\/span>[\/vc_column_text][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; id=&#8221;3&#8243; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h2><strong>e-TECHNIPOL\u00ae materials for electronic encapsulation<\/strong><\/h2>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\">Within the partnership, <\/span><b>SIPOL<\/b><span style=\"font-weight: 400;\"> provides the <\/span><b>material foundation<\/b><span style=\"font-weight: 400;\"> of the process through the <\/span><b>e-TECHNIPOL\u00ae<\/b><span style=\"font-weight: 400;\"> range, <\/span><b>hot melt adhesives<\/b><span style=\"font-weight: 400;\"> developed for <\/span><b>electronic encapsulation<\/b><span style=\"font-weight: 400;\"> applications.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">These materials, available in <\/span><b>polyamide-based<\/b><span style=\"font-weight: 400;\"> and <\/span><b>polyester<\/b><span style=\"font-weight: 400;\"> formulations, ensure:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>protection<\/b><span style=\"font-weight: 400;\"> from water, dust and vibrations,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>resistance<\/b><span style=\"font-weight: 400;\"> to low and high temperatures,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>chemical resistance<\/b><span style=\"font-weight: 400;\"> to oils, solvents and cleaning agents,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>insulating properties<\/b><span style=\"font-weight: 400;\"> for electronic components,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>high mechanical properties, <\/b><span style=\"font-weight: 400;\">particularly flexibility at low and high temperatures.<\/span><\/li>\n<\/ul>\n[\/vc_column_text][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; id=&#8221;4&#8243; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h3><strong>Characteristics of e-TECHNIPOL\u00ae products used in Low Pressure Molding<\/strong><\/h3>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\">Among the relevant technical characteristics:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>waterproofing<\/b><span style=\"font-weight: 400;\"> up to <\/span><b>IP68<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">compliance with <\/span><b>RoHS<\/b><span style=\"font-weight: 400;\"> and <\/span><b>REACH<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>absence of solvents<\/b><span style=\"font-weight: 400;\"> (VOC),<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>high flexibility<\/b><span style=\"font-weight: 400;\"> without brittleness on impact.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">The materials are designed to be <\/span><b>molded<\/b> <b>directly<\/b><span style=\"font-weight: 400;\"> onto <\/span><b>PCBs<\/b><span style=\"font-weight: 400;\"> and <\/span><b>electronic components<\/b><span style=\"font-weight: 400;\">, enabling <\/span><b>complete protection<\/b><span style=\"font-weight: 400;\"> without compromising the integrity of the device.<\/span>[\/vc_column_text][image_with_animation image_url=&#8221;37677&#8243; image_size=&#8221;full&#8221; max_width=&#8221;custom&#8221; animation_type=&#8221;entrance&#8221; animation=&#8221;None&#8221; animation_movement_type=&#8221;transform_y&#8221; hover_animation=&#8221;none&#8221; alignment=&#8221;&#8221; border_radius=&#8221;15px&#8221; box_shadow=&#8221;none&#8221; image_loading=&#8221;default&#8221; max_width_custom=&#8221;30%&#8221;][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; id=&#8221;5&#8243; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h2><strong>TECNO INCOLLAGGI: Low Pressure Molding process control<\/strong><\/h2>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\">The <\/span><b>process component<\/b><span style=\"font-weight: 400;\"> is entrusted to <\/span><b>TECNO INCOLLAGGI<\/b><span style=\"font-weight: 400;\"> through the <\/span><b>Tecnostar Overmolding System<\/b><span style=\"font-weight: 400;\">, a machine designed for <\/span><b>Low Pressure Molding<\/b><span style=\"font-weight: 400;\"> applications with <\/span><b>polyamide hot melt adhesives<\/b><span style=\"font-weight: 400;\">.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">The system integrates:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>melter<\/b><span style=\"font-weight: 400;\"> with <\/span><b>integrated pressing plate<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>high-precision gear volumetric pump<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>complete control<\/b><span style=\"font-weight: 400;\"> of <\/span><b>parameters<\/b><span style=\"font-weight: 400;\"> via <\/span><b>PLC<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>automatic injector<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">This configuration enables:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>accurate control<\/b><span style=\"font-weight: 400;\"> of <\/span><b>injection times<\/b><span style=\"font-weight: 400;\"> and <\/span><b>dwell times<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>stability<\/b><span style=\"font-weight: 400;\"> of the <\/span><b>material<\/b><span style=\"font-weight: 400;\"> during the process,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>consistent quality<\/b> of the finished product.<\/li>\n<\/ul>\n[\/vc_column_text][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; id=&#8221;6&#8243; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h3><strong>What the Tecnostar system guarantees<\/strong><\/h3>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\">From an operational standpoint, the system guarantees:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>reduced oxidation<\/b><span style=\"font-weight: 400;\"> of the <\/span><b>resin<\/b><span style=\"font-weight: 400;\"> inside the melter,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>no alteration<\/b><span style=\"font-weight: 400;\"> of material color,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>controlled melting<\/b><span style=\"font-weight: 400;\"> of only the required quantity,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>reduction of production waste<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>reduced<\/b><span style=\"font-weight: 400;\"> machine <\/span><b>startup times<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">lower energy consumption.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">The <\/span><b>automated management<\/b><span style=\"font-weight: 400;\"> and parameter control enable a <\/span><b>repeatable<\/b><span style=\"font-weight: 400;\"> and <\/span><b>stable<\/b><span style=\"font-weight: 400;\"> process, a fundamental element in electronic applications.<\/span>[\/vc_column_text][divider line_type=&#8221;No Line&#8221; custom_height=&#8221;20&#8243;][image_with_animation image_url=&#8221;37675&#8243; image_size=&#8221;full&#8221; max_width=&#8221;100%&#8221; max_width_mobile=&#8221;default&#8221; animation_type=&#8221;entrance&#8221; animation=&#8221;None&#8221; animation_movement_type=&#8221;transform_y&#8221; hover_animation=&#8221;none&#8221; alignment=&#8221;&#8221; border_radius=&#8221;none&#8221; box_shadow=&#8221;none&#8221; image_loading=&#8221;default&#8221;][divider line_type=&#8221;No Line&#8221; custom_height=&#8221;20&#8243;][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; id=&#8221;7&#8243; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h2><strong>An integrated system: material and process in a single solution<\/strong><\/h2>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\">The collaboration between <\/span><b>Mascherpa<\/b><span style=\"font-weight: 400;\">, <\/span><b>SIPOL<\/b><span style=\"font-weight: 400;\"> and <\/span><b>TECNO INCOLLAGGI<\/b><span style=\"font-weight: 400;\"> results in an integrated system in which materials and process are designed to work together.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">The integration between <\/span><b>material<\/b><span style=\"font-weight: 400;\"> <\/span><b>formulation<\/b><span style=\"font-weight: 400;\">, <\/span><b>process<\/b><span style=\"font-weight: 400;\"> parameters and <\/span><b>injection<\/b><span style=\"font-weight: 400;\"> <\/span><b>technology<\/b><span style=\"font-weight: 400;\"> enables:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">high <\/span><b>encapsulation quality<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>uniform protection<\/b><span style=\"font-weight: 400;\"> of components,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>reduction<\/b><span style=\"font-weight: 400;\"> of <\/span><b>production variability<\/b><span style=\"font-weight: 400;\">.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">This approach is particularly relevant in applications where reliability and repeatability are critical, such as:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">encapsulated PCBs,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">connectors,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">sensors,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">electric micromotors,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">control units,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><span style=\"font-weight: 400;\">components subject to vibrations or aggressive environments.<\/span><\/li>\n<\/ul>\n[\/vc_column_text][\/vc_column][\/vc_row][vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;none&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; id=&#8221;8&#8243; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;no-extra-padding&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221; column_border_width=&#8221;none&#8221; column_border_style=&#8221;solid&#8221;][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]\n<h2><strong>Focus on PCB 2026: Low Pressure Molding technology at the trade show<\/strong><\/h2>\n[\/vc_column_text][vc_column_text css=&#8221;&#8221; text_direction=&#8221;default&#8221;]<span style=\"font-weight: 400;\">The technology developed in collaboration between <\/span><b>Mascherpa<\/b><span style=\"font-weight: 400;\">, <\/span><b>SIPOL<\/b><span style=\"font-weight: 400;\"> and <\/span><b>TECNO INCOLLAGGI<\/b><span style=\"font-weight: 400;\"> will be presented at <\/span><b>Focus on PCB 2026<\/b><span style=\"font-weight: 400;\">, where it will be possible to observe the <\/span><b>Low Pressure Molding system<\/b><span style=\"font-weight: 400;\"> directly and explore the applications.<\/span><\/p>\n<p><span style=\"font-weight: 400;\">During the trade show it will be possible to:<\/span><\/p>\n<ul>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>analyze<\/b><span style=\"font-weight: 400;\"> the <\/span><b>encapsulation process<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>evaluate materials<\/b><span style=\"font-weight: 400;\"> and <\/span><b>configurations<\/b><span style=\"font-weight: 400;\">,<\/span><\/li>\n<li style=\"font-weight: 400;\" aria-level=\"1\"><b>discuss<\/b><span style=\"font-weight: 400;\"> specific applications.<\/span><\/li>\n<\/ul>\n<p><span style=\"font-weight: 400;\">You can find us:  <\/span><\/p>\n<p><span style=\"font-weight: 400;\">\ud83d\udccd Vicenza<\/span><span style=\"font-weight: 400;\"><br \/>\n<\/span><span style=\"font-weight: 400;\">  \ud83d\udcc5 May 13-14, 2026<\/span><span style=\"font-weight: 400;\"><br \/>\n<\/span><span style=\"font-weight: 400;\">  \ud83d\udccc Hall 7 &#8211; Stand C44\/D43 <\/span><\/p>\n<p><b>Mascherpa<\/b><span style=\"font-weight: 400;\"> will be present together with its partners to present the Low Pressure Molding process and silicone solutions for <\/span><a href=\"https:\/\/mascherpa.it\/en\/product-guide\/product-guide\/electronics\/\"><b>electronic protection<\/b><\/a> <span style=\"font-weight: 400;\">of PCBs. For more information   <\/span><a href=\"https:\/\/mascherpa.it\/en\/contact\/\"><b>contact<\/b><\/a><span style=\"font-weight: 400;\"> our experts, or request a DEMO on the Low Pressure Molding process directly.<\/span>[\/vc_column_text][nectar_btn size=&#8221;large&#8221; open_new_tab=&#8221;true&#8221; button_style=&#8221;regular&#8221; button_color_2=&#8221;Accent-Color&#8221; icon_family=&#8221;none&#8221; text=&#8221;Request the DEMO and technical data sheets&#8221; url=&#8221;https:\/\/mascherpa.it\/en\/product-guide\/pcb-2026\/&#8221;][\/vc_column][\/vc_row]\n","protected":false},"excerpt":{"rendered":"<p><a href=\"https:\/\/mascherpa.it\/en\/blog\/37569-2\/\" class=\"excerpt\">[vc_row type=&#8221;in_container&#8221; full_screen_row_position=&#8221;middle&#8221; column_margin=&#8221;default&#8221; column_direction=&#8221;default&#8221; column_direction_tablet=&#8221;default&#8221; column_direction_phone=&#8221;default&#8221; bg_color=&#8221;#f7f7f7&#8243; scene_position=&#8221;center&#8221; text_color=&#8221;dark&#8221; text_align=&#8221;left&#8221; row_border_radius=&#8221;15px&#8221; row_border_radius_applies=&#8221;bg&#8221; row_position_desktop=&#8221;default&#8221; row_position_tablet=&#8221;inherit&#8221; row_position_phone=&#8221;inherit&#8221; overflow=&#8221;visible&#8221; overlay_strength=&#8221;0.3&#8243; gradient_direction=&#8221;left_to_right&#8221; shape_divider_position=&#8221;bottom&#8221; bg_image_animation=&#8221;clip-path&#8221; clip_path_animation_type=&#8221;default&#8221; clip_path_animation_applies=&#8221;default&#8221; clip_path_animation_addon=&#8221;none&#8221; gradient_type=&#8221;default&#8221; shape_type=&#8221;&#8221;][vc_column column_padding=&#8221;padding-3-percent&#8221; column_padding_tablet=&#8221;inherit&#8221; column_padding_phone=&#8221;inherit&#8221; column_padding_position=&#8221;all&#8221; flex_gap_desktop=&#8221;10px&#8221; column_element_direction_desktop=&#8221;default&#8221; column_element_spacing=&#8221;default&#8221; desktop_text_alignment=&#8221;default&#8221; tablet_text_alignment=&#8221;default&#8221; phone_text_alignment=&#8221;default&#8221; background_color_opacity=&#8221;1&#8243; background_hover_color_opacity=&#8221;1&#8243; column_backdrop_filter=&#8221;none&#8221; column_shadow=&#8221;none&#8221; column_border_radius=&#8221;none&#8221; column_link_target=&#8221;_self&#8221; column_position=&#8221;default&#8221; gradient_direction=&#8221;left_to_right&#8221; overlay_strength=&#8221;0.3&#8243; width=&#8221;1\/1&#8243; tablet_width_inherit=&#8221;default&#8221; animation_type=&#8221;default&#8221; bg_image_animation=&#8221;none&#8221; border_type=&#8221;simple&#8221;&#8230;<\/a><\/p>\n","protected":false},"author":4,"featured_media":31664,"comment_status":"closed","ping_status":"closed","sticky":false,"template":"","format":"standard","meta":{"footnotes":""},"categories":[3220,6490,6501],"tags":[3499],"class_list":{"0":"post-37668","1":"post","2":"type-post","3":"status-publish","4":"format-standard","5":"has-post-thumbnail","7":"category-electronics-en-2","8":"category-fairs-2025","9":"category-focus-on-pcb","10":"tag-mascherpa-en"},"yoast_head":"<!-- This site is optimized with the Yoast SEO plugin v27.5 - https:\/\/yoast.com\/product\/yoast-seo-wordpress\/ -->\n<title>Low Pressure Molding: Mascherpa partnership at Focus on PCB<\/title>\n<meta name=\"description\" content=\"Mascherpa presents Low Pressure Molding at Focus on PCB with SIPOL and TECNO INCOLLAGGI, integrating materials and process for electronic encapsulation.\" \/>\n<meta name=\"robots\" content=\"index, follow, max-snippet:-1, max-image-preview:large, max-video-preview:-1\" \/>\n<link rel=\"canonical\" href=\"https:\/\/mascherpa.it\/en\/blog\/37569-2\/\" \/>\n<meta property=\"og:locale\" content=\"en_US\" \/>\n<meta property=\"og:type\" content=\"article\" \/>\n<meta property=\"og:title\" content=\"Low Pressure Molding: Mascherpa partnership at Focus on PCB\" \/>\n<meta property=\"og:description\" content=\"Mascherpa presents Low Pressure Molding at Focus on PCB with SIPOL and TECNO INCOLLAGGI, integrating materials and process for electronic encapsulation.\" \/>\n<meta property=\"og:url\" content=\"https:\/\/mascherpa.it\/en\/blog\/37569-2\/\" \/>\n<meta property=\"og:site_name\" content=\"Mascherpa s.p.a\" \/>\n<meta property=\"article:published_time\" content=\"2026-05-05T09:34:16+00:00\" \/>\n<meta property=\"article:modified_time\" content=\"2026-05-05T09:37:01+00:00\" \/>\n<meta property=\"og:image\" content=\"https:\/\/mascherpa.it\/wp-content\/uploads\/2025\/05\/ETHBGZ.png\" \/>\n\t<meta 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class=\"yoast-schema-graph\">{\"@context\":\"https:\\\/\\\/schema.org\",\"@graph\":[{\"@type\":\"Article\",\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/#article\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/\"},\"author\":{\"name\":\"Mascherpa\",\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/#\\\/schema\\\/person\\\/4eb665b7a59162f0f3162863f6eeac76\"},\"headline\":\"Low Pressure Molding: SIPOL and TECNO INCOLLAGGI together with Mascherpa at Focus on PCB.\",\"datePublished\":\"2026-05-05T09:34:16+00:00\",\"dateModified\":\"2026-05-05T09:37:01+00:00\",\"mainEntityOfPage\":{\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/\"},\"wordCount\":3521,\"image\":{\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mascherpa.it\\\/wp-content\\\/uploads\\\/2025\\\/05\\\/ETHBGZ.png\",\"keywords\":[\"mascherpa\"],\"articleSection\":[\"Electronics\",\"Fairs 2025\",\"Focus on PCB\"],\"inLanguage\":\"en-US\"},{\"@type\":\"WebPage\",\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/\",\"url\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/\",\"name\":\"Low Pressure Molding: Mascherpa partnership at Focus on PCB\",\"isPartOf\":{\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/#website\"},\"primaryImageOfPage\":{\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/#primaryimage\"},\"image\":{\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/#primaryimage\"},\"thumbnailUrl\":\"https:\\\/\\\/mascherpa.it\\\/wp-content\\\/uploads\\\/2025\\\/05\\\/ETHBGZ.png\",\"datePublished\":\"2026-05-05T09:34:16+00:00\",\"dateModified\":\"2026-05-05T09:37:01+00:00\",\"author\":{\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/#\\\/schema\\\/person\\\/4eb665b7a59162f0f3162863f6eeac76\"},\"description\":\"Mascherpa presents Low Pressure Molding at Focus on PCB with SIPOL and TECNO INCOLLAGGI, integrating materials and process for electronic encapsulation.\",\"breadcrumb\":{\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/#breadcrumb\"},\"inLanguage\":\"en-US\",\"potentialAction\":[{\"@type\":\"ReadAction\",\"target\":[\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/\"]}]},{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/#primaryimage\",\"url\":\"https:\\\/\\\/mascherpa.it\\\/wp-content\\\/uploads\\\/2025\\\/05\\\/ETHBGZ.png\",\"contentUrl\":\"https:\\\/\\\/mascherpa.it\\\/wp-content\\\/uploads\\\/2025\\\/05\\\/ETHBGZ.png\",\"width\":1520,\"height\":638,\"caption\":\"Adesivi hot melt per packaging ed etichettatura\"},{\"@type\":\"BreadcrumbList\",\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/37569-2\\\/#breadcrumb\",\"itemListElement\":[{\"@type\":\"ListItem\",\"position\":1,\"name\":\"mascherpa.it\",\"item\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/home\\\/\"},{\"@type\":\"ListItem\",\"position\":2,\"name\":\"Blog\",\"item\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/blog\\\/\"},{\"@type\":\"ListItem\",\"position\":3,\"name\":\"Low Pressure Molding: SIPOL and TECNO INCOLLAGGI together with Mascherpa at Focus on PCB.\"}]},{\"@type\":\"WebSite\",\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/#website\",\"url\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/\",\"name\":\"Mascherpa s.p.a\",\"description\":\"\",\"potentialAction\":[{\"@type\":\"SearchAction\",\"target\":{\"@type\":\"EntryPoint\",\"urlTemplate\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/?s={search_term_string}\"},\"query-input\":{\"@type\":\"PropertyValueSpecification\",\"valueRequired\":true,\"valueName\":\"search_term_string\"}}],\"inLanguage\":\"en-US\"},{\"@type\":\"Person\",\"@id\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/#\\\/schema\\\/person\\\/4eb665b7a59162f0f3162863f6eeac76\",\"name\":\"Mascherpa\",\"image\":{\"@type\":\"ImageObject\",\"inLanguage\":\"en-US\",\"@id\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/78e7d5b344152700bc02b73308e122fb0301a3829dfbf744307f050c5d6022c1?s=96&d=mm&r=g\",\"url\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/78e7d5b344152700bc02b73308e122fb0301a3829dfbf744307f050c5d6022c1?s=96&d=mm&r=g\",\"contentUrl\":\"https:\\\/\\\/secure.gravatar.com\\\/avatar\\\/78e7d5b344152700bc02b73308e122fb0301a3829dfbf744307f050c5d6022c1?s=96&d=mm&r=g\",\"caption\":\"Mascherpa\"},\"url\":\"https:\\\/\\\/mascherpa.it\\\/en\\\/author\\\/mascherpa\\\/\"}]}<\/script>\n<!-- \/ Yoast SEO plugin. -->","yoast_head_json":{"title":"Low Pressure Molding: Mascherpa partnership at Focus on PCB","description":"Mascherpa presents Low Pressure Molding at Focus on PCB with SIPOL and TECNO INCOLLAGGI, integrating materials and process for electronic encapsulation.","robots":{"index":"index","follow":"follow","max-snippet":"max-snippet:-1","max-image-preview":"max-image-preview:large","max-video-preview":"max-video-preview:-1"},"canonical":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/","og_locale":"en_US","og_type":"article","og_title":"Low Pressure Molding: Mascherpa partnership at Focus on PCB","og_description":"Mascherpa presents Low Pressure Molding at Focus on PCB with SIPOL and TECNO INCOLLAGGI, integrating materials and process for electronic encapsulation.","og_url":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/","og_site_name":"Mascherpa s.p.a","article_published_time":"2026-05-05T09:34:16+00:00","article_modified_time":"2026-05-05T09:37:01+00:00","og_image":[{"width":1520,"height":638,"url":"https:\/\/mascherpa.it\/wp-content\/uploads\/2025\/05\/ETHBGZ.png","type":"image\/png"}],"author":"Mascherpa","twitter_card":"summary_large_image","twitter_image":"https:\/\/mascherpa.it\/wp-content\/uploads\/2025\/05\/028-1024x538.png","twitter_misc":{"Written by":"Mascherpa","Est. reading time":"5 minutes"},"schema":{"@context":"https:\/\/schema.org","@graph":[{"@type":"Article","@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/#article","isPartOf":{"@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/"},"author":{"name":"Mascherpa","@id":"https:\/\/mascherpa.it\/en\/#\/schema\/person\/4eb665b7a59162f0f3162863f6eeac76"},"headline":"Low Pressure Molding: SIPOL and TECNO INCOLLAGGI together with Mascherpa at Focus on PCB.","datePublished":"2026-05-05T09:34:16+00:00","dateModified":"2026-05-05T09:37:01+00:00","mainEntityOfPage":{"@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/"},"wordCount":3521,"image":{"@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/#primaryimage"},"thumbnailUrl":"https:\/\/mascherpa.it\/wp-content\/uploads\/2025\/05\/ETHBGZ.png","keywords":["mascherpa"],"articleSection":["Electronics","Fairs 2025","Focus on PCB"],"inLanguage":"en-US"},{"@type":"WebPage","@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/","url":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/","name":"Low Pressure Molding: Mascherpa partnership at Focus on PCB","isPartOf":{"@id":"https:\/\/mascherpa.it\/en\/#website"},"primaryImageOfPage":{"@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/#primaryimage"},"image":{"@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/#primaryimage"},"thumbnailUrl":"https:\/\/mascherpa.it\/wp-content\/uploads\/2025\/05\/ETHBGZ.png","datePublished":"2026-05-05T09:34:16+00:00","dateModified":"2026-05-05T09:37:01+00:00","author":{"@id":"https:\/\/mascherpa.it\/en\/#\/schema\/person\/4eb665b7a59162f0f3162863f6eeac76"},"description":"Mascherpa presents Low Pressure Molding at Focus on PCB with SIPOL and TECNO INCOLLAGGI, integrating materials and process for electronic encapsulation.","breadcrumb":{"@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/#breadcrumb"},"inLanguage":"en-US","potentialAction":[{"@type":"ReadAction","target":["https:\/\/mascherpa.it\/en\/blog\/37569-2\/"]}]},{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/#primaryimage","url":"https:\/\/mascherpa.it\/wp-content\/uploads\/2025\/05\/ETHBGZ.png","contentUrl":"https:\/\/mascherpa.it\/wp-content\/uploads\/2025\/05\/ETHBGZ.png","width":1520,"height":638,"caption":"Adesivi hot melt per packaging ed etichettatura"},{"@type":"BreadcrumbList","@id":"https:\/\/mascherpa.it\/en\/blog\/37569-2\/#breadcrumb","itemListElement":[{"@type":"ListItem","position":1,"name":"mascherpa.it","item":"https:\/\/mascherpa.it\/en\/home\/"},{"@type":"ListItem","position":2,"name":"Blog","item":"https:\/\/mascherpa.it\/en\/blog\/"},{"@type":"ListItem","position":3,"name":"Low Pressure Molding: SIPOL and TECNO INCOLLAGGI together with Mascherpa at Focus on PCB."}]},{"@type":"WebSite","@id":"https:\/\/mascherpa.it\/en\/#website","url":"https:\/\/mascherpa.it\/en\/","name":"Mascherpa s.p.a","description":"","potentialAction":[{"@type":"SearchAction","target":{"@type":"EntryPoint","urlTemplate":"https:\/\/mascherpa.it\/en\/?s={search_term_string}"},"query-input":{"@type":"PropertyValueSpecification","valueRequired":true,"valueName":"search_term_string"}}],"inLanguage":"en-US"},{"@type":"Person","@id":"https:\/\/mascherpa.it\/en\/#\/schema\/person\/4eb665b7a59162f0f3162863f6eeac76","name":"Mascherpa","image":{"@type":"ImageObject","inLanguage":"en-US","@id":"https:\/\/secure.gravatar.com\/avatar\/78e7d5b344152700bc02b73308e122fb0301a3829dfbf744307f050c5d6022c1?s=96&d=mm&r=g","url":"https:\/\/secure.gravatar.com\/avatar\/78e7d5b344152700bc02b73308e122fb0301a3829dfbf744307f050c5d6022c1?s=96&d=mm&r=g","contentUrl":"https:\/\/secure.gravatar.com\/avatar\/78e7d5b344152700bc02b73308e122fb0301a3829dfbf744307f050c5d6022c1?s=96&d=mm&r=g","caption":"Mascherpa"},"url":"https:\/\/mascherpa.it\/en\/author\/mascherpa\/"}]}},"_links":{"self":[{"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/posts\/37668","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/posts"}],"about":[{"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/types\/post"}],"author":[{"embeddable":true,"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/users\/4"}],"replies":[{"embeddable":true,"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/comments?post=37668"}],"version-history":[{"count":5,"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/posts\/37668\/revisions"}],"predecessor-version":[{"id":37682,"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/posts\/37668\/revisions\/37682"}],"wp:featuredmedia":[{"embeddable":true,"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/media\/31664"}],"wp:attachment":[{"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/media?parent=37668"}],"wp:term":[{"taxonomy":"category","embeddable":true,"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/categories?post=37668"},{"taxonomy":"post_tag","embeddable":true,"href":"https:\/\/mascherpa.it\/en\/wp-json\/wp\/v2\/tags?post=37668"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}