Junction boxes

Mostra Nascondi Filtri
  • DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
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    DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
    • Reduces pressure on components
    • Effectively dissipates heat
    • Avoids delamination problems
    • The rapid polymerization
    • Optimized processing time
    • Allows for the implementation of complex projects
    • No additional dielectric barrier required
    • Allows for quick filling
    • It is suitable for high-throughput production processes.
    • Filling allows easy control of the process
    • Meets certification requirements