One-component silicone

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13 Electronics adhesive Electronics adhesive

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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Hot polymerization
- Good thermal conductivity values
- No solvent added
- Single-component - No need to mix separate components
- Fast and versatile polymerization controlled by temperature
- Fills and self-levels after dispensing
- Heat dissipation from PCB systems to increase reliability
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DOWSIL™ 3140 RTV Coating
- Single-component
- Does not require mixing
- Good fluidity
- Capable of flowing, filling or self-leveling
- Polymerization at room temperature
- No solvent added
- UV indicator for manual and automatic inspections
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DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
- Mellow
- High tensile strength and elongation resistance
- High thermal stability
- Single component - Does not require mixing
- Polymerization at room temperature
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
- Mellow
- Polymerization in rapid RTV
- Good "green" resistance
- Single-component - No mixing required
- Polymerization at room temperature
- Fast skin time
- High self-extinguishing
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DOWSIL™ 739 Plastic Adhesive
- Mellow
- High elongation by stress reduction
- Single-component - No mixing required
- Polymerization at room temperature
- High self-extinguishing
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DOWSIL™ 744 RTV Adhesive Sealant
- Cures at room temperature
- Pasty consistency
- It does not drip
- Easy to apply
- High elongation
- Stable and flexible over a wide temperature range
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DOWSIL™ 866 Primerless Silicone Adhesive
- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
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DOWSIL™ DA-6534 Adhesive
- Low ionic impurities
- Very high thermal conductivity
- Loaded silver
- Good adhesion to Ni, Al, laminate and silicon
- Microelectronic grade material
- High electroconductive performance
- Good adhesive performance for TIM1 applications
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DOWSIL™ EC-6601 Electrically Conductive Adhesive
- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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DOWSIL™ SE 9120 S
- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
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DOWSIL™ SE 9185
- Rapid polymerization in RT
- Mellow
- High elongation
- Controlled volatility of silicone
- Single-component - No mixing required
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DOWSIL™ SE 9186 Sealant
- Volatility-controlled silicone
- Polymerizes into a soft and elastic elastomer
- No solvent added
- Single-component - No mixing required
- Polymerization at room temperature
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DOWSIL™ SE 9188 RTV Adhesive
- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0