2% (ISO 527)

    • Tenacious
    • Ideal for bonding GRP, SMC and dissimilar substrates
    • Fills in gaps, does not drip up to 10 mm thick
    • Good resistance to weathering
    • Tenacious
    • Ideal for bonding GRP, SMC and dissimilar substrates
    • Fills in gaps, does not drip up to 10 mm thick
    • Good resistance to weathering
    • Very high mechanical strength
    • Low permanent deformation
    • High elastic modulus
    • No shrinkage during curing
    • Available with different pot life times (6, 15, 30 min)
    • Good adhesion on rigid plastic, steel, aluminum, composites
    • Suitable for sandwich elements and structures subjected to dynamic loads
    • Two-component