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Showing all 10 results

Product type

1 Conformal coating Conformal coating
3 Electronics adhesive Electronics adhesive
1 Heat-conductive adhesive Heat-conductive adhesive
5 Resins and encapsulants Resins and encapsulants

Technology

Applications

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DOWSIL™ 340 Heat Sink Compound
- Not smooth
- Moderate thermal conductivity
- Does not require ovens or curing
- Heat flow away from circuit components can increase reliability
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DOWSIL™ 866 Primerless Silicone Adhesive
- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
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DOWSIL™ EC-6601 Electrically Conductive Adhesive
- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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DOWSIL™ Q5-8401 Adhesive
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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DOWSIL™ SE 9157 Conformal Coating
- Rapid polymerization in RT, without notches
- Medium viscosity
- Polymerizes into a soft, low-stress elastomer
- Without added solvents
- Slight thermal acceleration can speed up in-line processing
- Soft coating can improve reliability against stresses
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SYLGARD™ 160 Silicone Elastomer Kit
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 164 Silicone Elastomer Kit
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 170 Silicone Elastomer Kit
- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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SYLGARD™ 184 Silicone Elastomer Kit

Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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SYLGARD™ 567 Primerless Silicone Encapsulant Kit
- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties

Connectors

Filtri

Product type

Technology

Applications

DOWSIL™ 340 Heat Sink Compound

DOWSIL™ 866 Primerless Silicone Adhesive

DOWSIL™ EC-6601 Electrically Conductive Adhesive

DOWSIL™ Q5-8401 Adhesive

DOWSIL™ SE 9157 Conformal Coating

SYLGARD™ 160 Silicone Elastomer Kit

SYLGARD™ 164 Silicone Elastomer Kit

SYLGARD™ 170 Silicone Elastomer Kit

SYLGARD™ 184 Silicone Elastomer Kit

SYLGARD™ 567 Primerless Silicone Encapsulant Kit

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