Connectors
Showing all 10 results
Filtri
Tipo di prodotto
- 1 Conformal coating
- 3 Electronics adhesive
- 1 Heat-conductive adhesive
- 5 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
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- Not smooth
- Moderate thermal conductivity
- Does not require ovens or curing
- Heat flow away from circuit components can increase reliability
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- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
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- Electromagnetic shielding
- Easy to dose and cure at room temperature
- Dow's unique formulation enables adhesion to a variety of substrates
- Durable mechanical and conductive properties, reliable performance
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- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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- Rapid polymerization in RT, without notches
- Medium viscosity
- Polymerizes into a soft, low-stress elastomer
- Without added solvents
- Slight thermal acceleration can speed up in-line processing
- Soft coating can improve reliability against stresses
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- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
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- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties
