Lids and housings
Showing all 8 results
Filtri
Tipo di prodotto
- 8 Electronics adhesive
Marchio
Tecnologia
Applicazioni
-
- Fluid
- Hot polymerization
- Good thermal conductivity values
- No solvent added
- Single-component - No need to mix separate components
- Fast and versatile polymerization controlled by temperature
- Fills and self-levels after dispensing
- Heat dissipation from PCB systems to increase reliability
-
- Mellow
- High tensile strength and elongation resistance
- High thermal stability
- Single component - Does not require mixing
- Polymerization at room temperature
-
- Mellow
- Polymerization in rapid RTV
- Good "green" resistance
- Single-component - No mixing required
- Polymerization at room temperature
- Fast skin time
- High self-extinguishing
-
- Mellow
- High elongation by stress reduction
- Single-component - No mixing required
- Polymerization at room temperature
- High self-extinguishing
-
- Cures at room temperature
- Pasty consistency
- It does not drip
- Easy to apply
- High elongation
- Stable and flexible over a wide temperature range
-
- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
-
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
-
- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0
