Brands

    • Hot polymerization
    • High tensile strength
    • Single component - Does not require mixing
    • Fast and versatile curing with heat input fill or self-leveling after deployment
    • High thermal conductivity
    • Optimal heat dissipation
    • Low viscosity for easy application
    • Used as thermal interface material
    • Based on a non-silicone oil
    • Avoids migration problems of silicone and siloxane LMW
    • Non-curing paste
    • Enables simple and efficient rework of components
    • General purpose thermal management paste
    • Excellent stability under a wide range of conditions
    • Silicone oil-based
    • Wide operating temperature range
    • Good thermal conductivity
    • Use as a thermal interface material
    • Non-curing paste
    • Allows rework of components
    • Thermal conductivity at elevated temperatures
    • Very low oil separation
    • Excellent anti-creep characteristics
    • Wide range of operating temperatures
    • Low evaporation weight loss
    • Optimal heat dissipation efficiency
    • Also facilitates application by screen printing
    • Non-hardening paste
    • Allows for easy rework
    • Very low contact resistance
    • Ideal for low current switches
    • Suitable for sensitive plastics (ABS/PC)
    • Improves the quality of the switch
    • Excellent mechanical properties that ensure smooth operation
    • Provides optimal mechanical strength
    • Reduces electrical background noise
    • Increased adhesion strength
    • Can be used as a sealant or thermal adhesive
    • High thermal conductivity
    • Combines adhesive and heat dissipation properties
    • Very wide operating temperature range
    • Single-component
    • Not lumpy
    • Ideal if high viscosity product required
    • Excellent lubrication properties
    • Spiral-shaped molecules
    • Produces low and constant mV drop and contact resistance
    • Low weight loss by evaporation
    • Loosens tarnish and corrosion, leaving a protective film to prevent further contamination
    • Highly stable synthetic material
    • Fully inhibited against copper corrosion
    • Improves contact performance by increasing the effective contact area
    • Increased compatibility with plastics
    • Highly stable synthetic material, fully inhibited against oxidation and copper corrosion
    • Excellent penetration and cooling properties
    • Prevents arcing, thereby reducing contact wear and tear
    • Excellent resistance to seawater
    • High toughness and tear resistance
    • Good adhesion to most substrates
    • Soft, reworkable resin
    • It can be "dug out"
    • Flexible even in extreme temperatures
    • Ideal for prototype circuits
    • Replacement of silicone and control unit
    • Excellent electrical properties
    • Low dielectric constant
    • Excellent resistance to seawater
    • Very low viscosity
    • Rugged and tear-resistant
    • Low water absorption
    • Excellent resistance to oxidation
    • Excellent adhesion
    • High degree of toughness
    • Adhesion to a wide variety of substrates
    • Easy application
    • Perfect where moisture ingress is a problem
    • Semi-rigid polyurethane resin
    • Exceptional toughness
    • Excellent adhesion
    • Excellent chemical resistance
    • Effective potting
    • Low water absorption
    • Good electrical properties
    • Quick-cure version available
    • Durable, low-viscosity system
    • Ideal for encapsulation of LEDs
    • Mixing ratio 1:1 by volume
    • Promotes ease of processing
    • Does not contain IPDI; low-risk material
    • Resists water and mold growth
    • Durable and low viscosity
    • Ideal for LED applications
    • Mixing ratio 1:1 by volume
    • Does not contain IPDI; low-risk material
    • Suitable for a wide range of environments
    • Dual polymerization system
    • Eliminates the use of solvents
    • VOC-free and non-flammable coating
    • Does not require dilution
    • Low viscosity
    • Ready to use for selective spray application
    • Maximum protection in harsh environments
    • Thermal conductivity of 1.4 W/(m-K)
    • Mixing ratio 1:1
    • Processing time: 45 minutes
    • Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
    • Provides strong electrical insulation
    • High mechanical strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Thermal conductivity of 0.8 W/(m-K)
    • Mixing ratio 1:1
    • Fire retardant - UL 94V-0 registered
    • Processing time: 5 minutes
    • Laying time: 15 minutes
    • Provides strong electrical insulation
    • Low CTE before Tg
    • High tensile and compressive strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substratesStorage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Low outgassing approved by NASA
    • Extreme electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Working time: 4 hours
    • Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
    • Creates strong permanent electrical connections
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons