Brands
Showing 41–60 of 60 results
Filtri

Tipo di prodotto
- 1 Conductive paints
- 9 Conformal coating
- 5 Electrically conductive adhesives
- 2 Gel
- 4 Greases
- 24 Resins and encapsulants
- 5 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
-
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
-
- Low outgassing approved by NASA
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
-
- Provides >52 dB RFI shielding at frequencies <1 MHz
- Excellent adhesion to plastics
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene or xylene
-
- UL Recognized (File No. E202609)
- Provides effective EMI/RFI shielding over a wide range of frequencies
- Strong corrosion resistance
- Gentle and safe solvent system on polystyrenes
- HAP free-does not contain toluene, xylene, or MEK
- Available in aerosol format
-
- Good conductivity
- Provides good RFI shielding
- Extreme durability and grip
- Strong resistance to solvents
- Excellent corrosion and salt spray resistance
-
- Provides effective EMF shielding
- Ideal for wood and drywall
- Ideal for shielding the cavities of electric guitars
- Non-flammable and without harmful odors
- Low VOC content
-
- Provides superior EMI shielding
- Excellent adhesion to plastics
- Minimum height of thin layer
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene, xylene or MEK
-
- Upper EMI shielding
- Polymerization at room temperature and high
- Excellent chemical and corrosion resistance
- Stable under extreme environmental conditions (100 hours at 150˚C, 100 hours at 85˚C/85% RH)
- Resists wave soldering
- Without MEK and HAPS
-
- Provides excellent EMI/RFI shielding over a wide frequency range
- Non-flammable and without harmful odors
- Shipping as non-DG by air
- Low VOC content
-
- Provides excellent electromagnetic shielding
- Ideal for wood and drywall
- Ideal for musical instruments
- Non-flammable and without harmful odors
- Low VOC content
-
- High electrical conductivity
- Creates strong permanent electrical connections
- No mixing is required
- Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
- Storage at room temperature (≤ 22 °C)
- Suitable for automated distribution
-
- High thermal conductivity
- No mixing is required before use
- Provides strong electrical insulation
- Low curing temperature (<100 °C)
- Storage at room temperature (≤ 22 °C)
- Binds well to a wide variety of substances
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
-
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
-
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
-
- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
-
Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
-
- General use
- Low viscosity
- Addition curing system
- No polymerization by-products
- Self-healing gel
- Permanent pressure-sensitive adhesion
- Excellent dielectric properties
- Long-term sealing against atmospheric contaminants
-
- Seals and protects PCBs and electronic devices
- Used for delicate electrical devices
- Offers excellent flexibility
- Cures even at room temperature
- Isolate circuits from harmful effects
- Special class of encapsulants
- Polymerizes into an extremely soft material
- Protects circuits and interconnections
- Operational over a wide temperature range
-
- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties
-
- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability













