Brands
Showing 121–140 of 222 results
Filtri
The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
-
- Very low viscosity
- Excellent wettability on low surface energy substrates
- Improves adhesion to difficult-to-bond substrates
- Specially formulated for the adhesion of polyolefins
- Suitable for use with other cyanoacrylates
- Dries in seconds
- Increases adhesion strength
-
- Fixing time in 60 seconds
- Hardens in 5-10 minutes
- Instant adhesion with high bond strength
- Low volumetric contraction: 4.3 percent
- Fills empty spaces of large volumes
- Bonding a wide range of materials
- Workable, sandable and paintable once cured
- Impact resistant
- The gel allows for precise application
- Non-drip for vertical applications
-
- High strength
- Low viscosity
- High power transmission
- Resistance to dynamic loads
- Resistant to vibration
- Recommended for gaps up to 0.15 mm
- Corrosion prevention
- Single component
-
- High strength
- High viscosity
- High power transmission
- Resistance to dynamic loads
- Vibration resistance
- Corrosion prevention
- Recommended for gaps up to 0.2 mm
- Single component
- Suitable for active and passive metals
-
- High strength
- Medium viscosity
- High power transmission
- Resistance to dynamic loads
- Recommended for gaps up to 0.15 mm Vibration resistant
- Corrosion prevention
- Single component
- Suitable for active and passive metals
-
- High strength
- High viscosity / Paste
- High gap filling (up to 0.5 mm)
- High power transmission
- Resistance to dynamic loads
- Vibration resistance
- Corrosion prevention
- Single component
- Suitable for active and passive metals
-
- Grip time 30 seconds
- High adhesion strength: > 6 MPa after 5 min
- Open time 25 minutes
- Filling gaps between substrates up to 5 mm
- Excellent adhesion to a wide variety of substrates
- Translucent when cross-linked
- Resistant to temperature and humidity
- Gel consistency for precise dosing
-
- High adhesion strength
- Long time open
- Low blooming
- Less brittle than conventional instant adhesives
- They glue a wide range of materials, including polystyrene
-
- Two-component syntactic epoxy system
- Medium density and low specific weight
- High mechanical strength
- Pourable
- Designed for honeycomb structure reinforcement and potting
-
- Addition curing system
- Cures into a durable and flexible rubber
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Rapid thermal polymerization
- Excellent heat resistance (up to 250ºC)
-
- Medium hardness (Shore 00)
- Promotes application on sloping surfaces
- Easy to use
- Mixing ratio
- Rapid polymerization at room temperature
- It does not require temporary storage of the
- equipped parts
- Low compression set maintained at high service temperatures
- Stable and flexible over a wide range of temperatures
-
- Medium hardness (Shore 00)
- Reduced flow favors application on sloping surfaces
- Easy to use, handy 1:1 mixing ratio
- Rapid curing at room temperature, with no need for temporary storage of the equipped parts
- Low compression set that is maintained at high service temperatures service temperatures
- Stable and flexible over a wide range of temperatures
-
- Adhesion to metals and plastics
- Weathering resistance
- UV resistance
- Non-corrosive
- Neutral polymerization
- Not oily
- Ready to use
- Short time of no adherence
- Solvent-free: low shrinkage
- Good mechanical properties: high
- Tear resistance
- Elongation resistance
- Tensile strength
-
- One-part dielectric gel
- Transparent
- Hot polymerization
- Low viscosity
- Very soft gel
- Suitable for PCB potting and electronic component protection
- Electrical insulation and environmental protection
- Extended temperature range (-60°C / +200°C)
- No mixing required
-
- Non-curing
- High thermal conductivity
- Stable on vertical surfaces
- Gap filling capacity up to 1.0 mm
- Thermally conductive silicone material
- Low thermal resistance and good high-temperature stability
-
- Low density
- Room temperature or heat-accelerated polymerization
- Non-sagging, stable even on vertical surfaces
- Soft and deformable material with stress relief function
- Slightly tacky surface after curing
- No exotherm during curing
-
- Non-curing
- High thermal conductivity
- Low thermal resistance
- Solvent-free formulation
- Thixotropic - low flowability
- Applicable via screen printing, stencil or dispensing
- Ability to achieve thin thicknesses
-
- Not smooth
- Low levels of volatile condensable materials
- High elongation for greater stress reduction
- No mixing required
- Faster inline machining with optional thermal acceleration
- Proven for space applications
-
- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Excellent adhesion to many substrates
- Stable and flexible from -40°C (-40°F) to 180°C (356°F)
-
- Provides instant green force
- Easy-to-use one-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Pasty and non-sticky consistency
- Cures into a durable and flexible rubber
- Stable and flexible from -50°C to +150°C
- UL 94 HB
- Rapid resistance formation promotes increased productivity due to rapid handling of bonded units
- Saves time because no buffer is needed for increasing resistance
