MIL Spec UL Recognized

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    • Single-component silicone conformal coating
    • Transparent
    • Thermal polymerization
    • Designed for the protection of rigid and flexible printed circuit boards.
    • Low viscosity
    • Without added solvents
    • Cures into a soft, low-stress elastomer, reducing stress on electronic components.
    • Incorporates a UV indicator to facilitate automated inspection
    • UL, IPC and MIL certified.
    • Not smooth
    • Polymerization at room temperature
    • High elongation for greater stress reduction
    • No mixing required
    • Polymerization at room temperature, no need for ovens
    • Faster inline machining with optional thermal acceleration
    • Improved reliability through reduced curing stresses
    • Automated or manual needle dispensing systems
    • Two-part silicone adhesive
    • Non-sag
    • Fast low-temperature cure
    • Accelerated cure at moderate temperature (80 °C)
    • Rapid adhesion development.
    • The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
    • Maintains physical and electrical properties across a wide range of operating conditions.
    • Primerless adhesion