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UL RTI 150

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1 Gel Gel
2 Resins and encapsulants Resins and encapsulants

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DOWSIL™ 3-4241 Dielectric Tough Gel Kit
- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Good mechanical strength
- Contains UV indicator for inspection
- Adhesion without the use of primer
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
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DOWSIL™ TC-6020 Thermally Conductive Encapsulant
- Two-component thermal conductive encapsulant
- Suitable for PCB system
- Protection in harsh environmental and thermal conditions
- Can be used at room temperature
- Used in the production of electrical products, PCBs and modules
- Good adhesion to aluminum
- Excellent dielectric properties
- Good smoothness
- Easy dispensing
- Good flexibility for easy processing
- Good adhesion without the use of primer
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SYLGARD™ 160 Silicone Elastomer Kit
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity

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