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5 Resins and encapsulants Resins and encapsulants

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Technology

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Applications

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Araldite® CW 2243-1L
- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
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Araldite® CY 221 / Aradur® HY 2966
- Good heat resistance
- Resistant to atmospheric and chemical degradation
- Good crack resistance
- Excellent castability and impregnation
- Mixing ratio 100:25 by weight
- Elastic thermal shock absorberepentine system
- Suitable for low-stress encapsulants
- Excellent electrical properties
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Arathane® CW 5620
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
- Two-component resin for high temperature
- It cross-links at room temperature but can be accelerated with heat
- Halogen-free system
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Arathane® Vb U 6912 P Polyol / Vb U001/B Isocian
- Polymerization at room temperature or moderate heat
- Easy castability and impregnation
- Mixing ratio 100:23 by weight
- Excellent electrical properties
- Absorbs sudden thermal shock
- Suitable for a low-stress encapsulant
- Halogen free