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Showing 21–40 of 79 results

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DOWSIL™ 7091 Adhesive Sealant
- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Excellent adhesion to many substrates
- Stable and flexible from -40°C (-40°F) to 180°C (356°F)
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DOWSIL™ 7093 Adhesive Sealant
- One-component adhesive sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy polymerization system
- Pasty consistency, does not bag
- Easy to apply
- Low modulus for high movement capacity
- Good adhesion on many substrates
- Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
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DOWSIL™ 832 Multi-Surface Adhesive Sealant
- 100% silicone
- Superior adhesion to a wide variety of surfaces
- Low odor
- Neutral polymerization (alcohol)
- Does not corrode metal or other sensitive materials
- Forms a flexible and long-lasting seal
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DOWSIL™ 866 Primerless Silicone Adhesive
- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
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DOWSIL™ 93-006-1 RF Sealant & Kit
- High viscosity
- Lump-free
- High performance
- Adheres well to primed surfaces
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DOWSIL™ 93-076 RF Aerospace Sealant

Good tensile strength High adhesive capacity Low thermal conductivity Good weather resistance Two-component with room temperature curing Stable even at high temperatures
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
- Low viscosity
- Good thermal conductivity
- Mixing ratio 1 to 1
- Polymerization at room temperature
- Easy to mix and use
- Good smoothness for fast processing and short cycle times
- Promotes heat dissipation
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DOWSIL™ DA-6534 Adhesive
- Low ionic impurities
- Very high thermal conductivity
- Loaded silver
- Good adhesion to Ni, Al, laminate and silicon
- Microelectronic grade material
- High electroconductive performance
- Good adhesive performance for TIM1 applications
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DOWSIL™ EA-2626 / Silastic™ Q3-3636
- Two-component adhesive sealant
- Rapid polymerization at room temperature
- Neutral alkoxide polymerization
- Pasty, non-self-levelling consistency
- Good and durable adhesion
- Excellent weather, UV and heat resistance up to 190°C
- Rapid curing allows rapid handling of bonded components
- Deep polymerization
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DOWSIL™ FIRESTOP 700 Silicone Sealant
- Meets BS 476 Part 22 standard
- Excellent primerless adhesion on most substrates
- porous and non-porous buildings
- It does not drip
- Joint movement capacity ±50%
- Neutral curing system
- Halogen-free
- Complies with ISO 11600-F&G-25LM Standard
- A fire resistance value of up to 4 hours can be obtained
- Extensively tested on many European specifications
- Out of footprint in 1.5 hours
- Excellent weathering characteristics, including resistance to ozone, UV radiation and extreme temperatures
- Long service life
- CE marked as fire resistant according to ETAG 026
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DOWSIL™ Q5-8401 Adhesive
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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DOWSIL™ SE 9188 RTV Adhesive
- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0
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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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DOWSIL™ TC-5622 Thermally Conductive Compound
- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
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Electrolube HTSP Silicone Heat Transfer Compound Plus
- Thermal conductivity at elevated temperatures
- Very low oil separation
- Excellent anti-creep characteristics
- Wide range of operating temperatures
- Low evaporation weight loss
- Optimal heat dissipation efficiency
- Also facilitates application by screen printing
- Non-hardening paste
- Allows for easy rework
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EPIBOND® 200 A/B
- Flexible epoxy structural adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Good performance retention after environmental aging
- 1:1 mixing ratio by weight and volume
- SVHC-free according to REACH
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EPIBOND® 315 A/B
- Two-component epoxy adhesive
- Pasty consistency
- High mechanical strength
- Good adhesion to metals
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EPOCAST® 1627-2
- High-performance structural syntactic epoxy, filled, for core reinforcement
- Extremely low coefficient of thermal expansion
- Supplied as frozen patty or Semco cartridge, ready to use after thawing (no weighing or mixing)
- High compressive strength
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EPOCAST® 1635 A/B
- Two-component syntactic epoxy adhesive
- Aluminum-filled
- Designed for repairing misdrilled holes in composite parts
- High compressive strength
- High dynamic fatigue resistance under load
- Usable up to 177 °C
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Epocast® 1636-A/B
- High-performance two-component system with high strength and good high-temperature resistance
- Aluminum-filled, medium viscosity, easy to handle
- Mechanically workable (easily machined after curing)
- Self-extinguishing