DOWSIL™ CN-8760 Thermally Conductive Encapsulant

  • Low viscosity
  • Good thermal conductivity
  • Mixing ratio 1 to 1
  • Polymerization at room temperature
  • Easy to mix and use
  • Good smoothness for fast processing and short cycle times
  • Promotes heat dissipation

Additional information

Product Type
Brand
Technology
Dielectric strength (kV/mm)
Viscosity
Color
Polimerizzazione
Tempo di Gel
Shore hardness ,
Elong. at break
UL94 self-extinguishing
Thermal conductivity (W/m.K) , ,
Thermal conductive
Applications , , , , ,