>0.5 / <0.7 W/m*K

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    • Black two-component thermally conductive epoxy resin
    • Designed for applications where thermal management is a critical factor
    • Thermal conductivity of 0.68 W/(m·K)
    • Low exotherm
    • Mixing ratio 1:1 by volume
    • High compressive and tensile strength
    • Excellent adhesion to metals, composites, glass, ceramics and numerous plastics
    • Excellent electrical insulation properties
    • High resistance to water and humidity
    • Protection from electrostatic discharge, vibration, abrasion, thermal shock, moisture, salt water, fungus and aggressive chemicals
    • Solvent-free