>1 / >2 W/m*K
Showing all 3 results
Filtri
Tipo di prodotto
- 3 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
-
- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
-
- Flame retardant
- Uses nonabrasive fillers
- Used for encapsulation of PCBs.
- Suitable for effective heat dissipation
- Provides environmental protection
-
- Improved thermal conductivity
- Low viscosity for a loaded system
- Contains no abrasive fillers
- Low wear and tear on dosing machinery
