>2 W/m*K

    • Two-component thermal conductive encapsulant
    • Suitable for PCB system
    • Protection in harsh environmental and thermal conditions
    • Can be used at room temperature
    • Used in the production of electrical products, PCBs and modules
    • Good adhesion to aluminum
    • Excellent dielectric properties
    • Good smoothness
    • Easy dispensing
    • Good flexibility for easy processing
    • Good adhesion without the use of primer