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>1 / >2 W/m*K

Showing all 9 results

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4 Electrically conductive adhesives Electrically conductive adhesives
1 Gap filler Gap filler
2 Heat-conductive adhesive Heat-conductive adhesive
1 Thermal conductive paste Thermal conductive paste

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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ TC-4515 Gap Filler A&B
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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DOWSIL™ TC-5080 Thermally Conductive Compound
- Good thermal conductivity
- Low oil bleed
- Stable at high temperatures
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Electrolube RTV Thermally Conductive Oxime
- Increased adhesion strength
- Can be used as a sealant or thermal adhesive
- High thermal conductivity
- Combines adhesive and heat dissipation properties
- Very wide operating temperature range
- Single-component
- Not lumpy
- Ideal if high viscosity product required
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MG Chemicals 8329TCM
- Thermal conductivity of 1.4 W/(m-K)
- Mixing ratio 1:1
- Processing time: 45 minutes
- Cure time: 24 hours at room temperature or 1 hour at 65 °C (149 °F)
- Provides strong electrical insulation
- High mechanical strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8330S
- Low outgassing approved by NASA
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331D
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 8331S
- Low outgassing approved by NASA
- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Working time: 4 hours
- Cure time: 2 hours at 65 °C (149 °F) or 30 minutes at 100 °C (212 °F)
- Creates strong permanent electrical connections
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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MG Chemicals 9410
- High electrical conductivity
- Creates strong permanent electrical connections
- No mixing is required
- Cure time: 1 hour at 90 °C (194 °F) or 7 minutes at 150 °C (302 °F)
- Storage at room temperature (≤ 22 °C)
- Suitable for automated distribution

>1 / >2 W/m*K

Filtri

Product type

Brands

Technology

Applications

DOWSIL™ 3-6753 Thermally Conductive Adhesive

DOWSIL™ TC-4515 Gap Filler A&B

DOWSIL™ TC-5080 Thermally Conductive Compound

Electrolube RTV Thermally Conductive Oxime

MG Chemicals 8329TCM

MG Chemicals 8330S

MG Chemicals 8331D

MG Chemicals 8331S

MG Chemicals 9410

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