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>2 / >3 W/m*K

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Product type

1 Electrically conductive adhesives Electrically conductive adhesives
1 Gap filler Gap filler
2 Heat-conductive adhesive Heat-conductive adhesive

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Technology

Technology

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Applications

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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
- Polymerization at room temperature
- Long-term performance stability up to 150°C
- Low compression stress
- Maintains upright position (cured or uncured state)
- Controlled volatility of silicone
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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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MG Chemicals 8330D
- Extreme electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substratesStorage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons

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