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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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ARALDITE® 1641 A/B
- Ultra-low density syntactic epoxy adhesive
- Easily pumpable
- Non-sag after application
- Good resistance to vibrational fatigue
- Designed to reduce cracking tendency in high-stress applications
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ARALDITE® 1644 A/B
- Ultra-low density syntactic epoxy adhesive
- Non-sag
- Designed for edge sealing and void filling
- High compressive strength-to-density ratio
- Manual or extrusion application
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CG 1305 A/B
- Two-component syntactic epoxy system
- Medium density and low specific weight
- High mechanical strength
- Pourable
- Designed for honeycomb structure reinforcement and potting
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DOWSIL™ 1-4105 Conformal Coating
- Single-component silicone conformal coating
- Transparent
- Thermal polymerization
- Designed for the protection of rigid and flexible printed circuit boards.
- Low viscosity
- Without added solvents
- Cures into a soft, low-stress elastomer, reducing stress on electronic components.
- Incorporates a UV indicator to facilitate automated inspection
- UL, IPC and MIL certified.
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DOWSIL™ 6-1125 Controlled Volatility Sealant
- One-part condensation cure silicone sealant
- Space grade
- Non-sag
- Low controlled volatility
- Cures at room temperature upon exposure to moisture
- Does not require mixing
- Designed for aerospace applications
- Provides high elongation
- Good physical and electrical stability
- Complies with NASA low outgassing requirements
- Protects components from extreme temperatures, high humidity, thermal shock, radiation, atomic oxygen, and mechanical vibration
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DOWSIL™ 93-500 Space Grade Encapsulant (Thixotropic)
- Two-part silicone elastomer encapsulant
- Low thermal vacuum outgassing
- Physical and electrical stability
- Wide operating temperature range.
- Certified to NASA requirements for extreme environment applications.
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DOWSIL™ CC-3122 Conformal Coating
- One-component silicone conformal coating
- Translucent
- Low viscosity
- Moisture cure (RTV)
- Solvent-free
- Provides environmental resistance
- Dielectric protection
- Long-term reliability even in harsh environmental conditions
- UL recognized and includes a UV indicator for coating inspection.
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DOWSIL™ EA-6060 Adhesive
- Two-part silicone adhesive
- Non-sag
- Fast low-temperature cure
- Accelerated cure at moderate temperature (80 °C)
- Rapid adhesion development.
- The formulation includes a scavenger to reduce void formation and a UV indicator to facilitate inspection operations.
- Maintains physical and electrical properties across a wide range of operating conditions.
- Primerless adhesion
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DOWSIL™ EG-1200 Gel
- Gel is a two-component addition-cure silicone gel
- Clear and flowable,
- Designed for optically clear potting and coupling applications in displays and LED lighting systems.
- High transparency
- Reduced yellowing
- High surface adhesion
- Good stress absorption capacity
- Provides mechanical protection, electrical insulation and long-term reliability.
- Can cure at room temperature or with thermal acceleration.
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EPIBOND® 115 A/B
- High-temperature structural epoxy adhesive
- Two-component epoxy adhesive
- Service up to 149°C (300°F)
- High shear strength on metals and composites
- Thixotropic gap-filling paste
- Contains 125-micron spacer beads
- High Tg
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EPOCAST® 1614-A3
- Syntactic structural epoxy adhesive
- Single-component supplied frozen
- Paste consistency after thawing
- Extrudable with standard equipment
- Designed for structural applications on honeycomb
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EPOCAST® 1617 A/B
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Good mechanical strength-to-density ratio
- Suitable for structural applications
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EPOCAST® 1618 D/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures
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EPOCAST® 1619-1 A/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures
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EPOCAST® 1626 C1/D2
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Designed for structural applications on sandwich panels
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EPOCAST® 1628 A/B
- Ultra-low density epoxy paste
- Flame retardant
- Extrudable and non-sagging
- Sandable and machinable after curing
- Suitable for edge reinforcement and honeycomb structure filling
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EPOCAST® 1629 A/B
- Ultra-low density epoxy syntactic paste
- Self-extinguishing
- Paste/putty consistency with good stability on vertical surfaces
- Sandable and machinable after curing
- Applicable for edge reinforcement of honeycomb structures
- Slump-resistant
- PBDE-free
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EPOCAST® 1635 A/B
- Two-component syntactic epoxy adhesive
- Aluminum-filled
- Designed for repairing misdrilled holes in composite parts
- High compressive strength
- High dynamic fatigue resistance under load
- Usable up to 177 °C
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Epocast® 1636-A/B
- High-performance two-component system with high strength and good high-temperature resistance
- Aluminum-filled, medium viscosity, easy to handle
- Mechanically workable (easily machined after curing)
- Self-extinguishing
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EPOCAST® 1645 FR A/B
- Ultra-low density structural syntactic paste
- Flame retardant, compliant with FAR 25.853a requirements
- Compliant with BMS 5-28 Type 9
- Self-extinguishing
- Easily hand-mixable
- Non-tacky
- Sandable after curing
- Suitable for structural reinforcement of sandwich panels
- Suitable for aerospace use