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Tipo di prodotto

11 Resins and encapsulants Resins and encapsulants

Marchio

Tecnologia

Applicazioni

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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EPOCAST® 1618 D/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures
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EPOCAST® 1619-1 A/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures
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EPOCAST® 1626 C1/D2
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Designed for structural applications on sandwich panels
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EPOCAST® 1628 A/B
- Ultra-low density epoxy paste
- Flame retardant
- Extrudable and non-sagging
- Sandable and machinable after curing
- Suitable for edge reinforcement and honeycomb structure filling
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EPOCAST® 1629 A/B
- Ultra-low density epoxy syntactic paste
- Self-extinguishing
- Paste/putty consistency with good stability on vertical surfaces
- Sandable and machinable after curing
- Applicable for edge reinforcement of honeycomb structures
- Slump-resistant
- PBDE-free
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EPOCAST® 1635 A/B
- Two-component syntactic epoxy adhesive
- Aluminum-filled
- Designed for repairing misdrilled holes in composite parts
- High compressive strength
- High dynamic fatigue resistance under load
- Usable up to 177 °C
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Epocast® 1636-A/B
- High-performance two-component system with high strength and good high-temperature resistance
- Aluminum-filled, medium viscosity, easy to handle
- Mechanically workable (easily machined after curing)
- Self-extinguishing
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EPOCAST® 1645 FR A/B
- Ultra-low density structural syntactic paste
- Flame retardant, compliant with FAR 25.853a requirements
- Compliant with BMS 5-28 Type 9
- Self-extinguishing
- Easily hand-mixable
- Non-tacky
- Sandable after curing
- Suitable for structural reinforcement of sandwich panels
- Suitable for aerospace use
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EPOCAST® 1648 A/B
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Non-sag after application
- Suitable for structural reinforcement applications
- Sandable after complete polymerization
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EPOCAST® 1649-1 A/B
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Non-sag after application
- Suitable for structural reinforcement operations
- Sandable after curing
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EPOCAST® 1652 A/B
- Low density syntactic epoxy adhesive
- Dense paste consistency
- High compressive strength
- Good high temperature performance after room temperature cure
- Suitable for core filling, stiffness enhancement and structural reinforcement
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EPOCAST® 50-A1 Resin / Hardener 9816
- Unfilled two-component epoxy system
- Solvent-free
- Easy to process
- High mechanical strength
- Flame retardant
- Long pot life
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EPOCAST® 52 A/B
- Two-component epoxy system for structural repairs
- Designed for aerospace composite repairs
- Good hot/wet resistance
- Resistant to fuels, hydraulic fluids, oils, and moisture
- Supplied in pre-measured resin + hardener kits
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EPOCAST® 54 A/B
- Two-component epoxy system
- Unfilled and solvent-free
- High mechanical strength
- Self-extinguishing
- Short pot life
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SYLGARD™ 160 Silicone Elastomer Kit
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 164 Silicone Elastomer Kit
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 170 Silicone Elastomer Kit
- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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SYLGARD™ 184 Silicone Elastomer Kit

Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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SYLGARD™ 567 Primerless Silicone Encapsulant Kit
- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties
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SYLGARD™ Q3-3600 Thermally Conductive Encapsulant
- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability