Sylgard
Showing all 8 results
Filtri
Tipo di prodotto
- 2 Gel
- 6 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
-
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
-
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
-
- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
-
Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
-
- General use
- Low viscosity
- Addition curing system
- No polymerization by-products
- Self-healing gel
- Permanent pressure-sensitive adhesion
- Excellent dielectric properties
- Long-term sealing against atmospheric contaminants
-
- Seals and protects PCBs and electronic devices
- Used for delicate electrical devices
- Offers excellent flexibility
- Cures even at room temperature
- Isolate circuits from harmful effects
- Special class of encapsulants
- Polymerizes into an extremely soft material
- Protects circuits and interconnections
- Operational over a wide temperature range
-
- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties
-
- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability
