Two-component at room temperature

Showing 61–80 of 97 results

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Born2Bond™ Structural
- Grip time 30 seconds
- High adhesion strength: > 6 MPa after 5 min
- Open time 25 minutes
- Filling gaps between substrates up to 5 mm
- Excellent adhesion to a wide variety of substrates
- Translucent when cross-linked
- Resistant to temperature and humidity
- Gel consistency for precise dosing
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CG 1305 A/B
- Two-component syntactic epoxy system
- Medium density and low specific weight
- High mechanical strength
- Pourable
- Designed for honeycomb structure reinforcement and potting
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DOWSIL™ 3-6548 Silicone RTV Foam
- Two-component fire-resistant RTV silicone foam
- Two-component room temperature vulcanizing (RTV) silicone foam
- Fire resistant
- Good flexibility even under severe operating conditions
- Withstand high temperatures
- Designed to limit hazards such as smoke, flames and gases.
- Expands and cures at room temperature to form a closed-cell foam elastomer.
- Designed for creating fire-resistant seals in penetrations and linear joints.
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DOWSIL™ 3-8219 RF Silicone Foam
- Medium hardness (Shore 00)
- Promotes application on sloping surfaces
- Easy to use
- Mixing ratio
- Rapid polymerization at room temperature
- It does not require temporary storage of the
- equipped parts
- Low compression set maintained at high service temperatures
- Stable and flexible over a wide range of temperatures
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DOWSIL™ 3-8259 RF Silicone Foam
- Medium hardness (Shore 00)
- Reduced flow favors application on sloping surfaces
- Easy to use, handy 1:1 mixing ratio
- Rapid curing at room temperature, with no need for temporary storage of the equipped parts
- Low compression set that is maintained at high service temperatures service temperatures
- Stable and flexible over a wide range of temperatures
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DOWSIL™ 93-006-1 RF Sealant & Kit
- High viscosity
- Lump-free
- High performance
- Adheres well to primed surfaces
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DOWSIL™ EA-2626 / Silastic™ Q3-3636
- Two-component adhesive sealant
- Rapid polymerization at room temperature
- Neutral alkoxide polymerization
- Pasty, non-self-levelling consistency
- Good and durable adhesion
- Excellent weather, UV and heat resistance up to 190°C
- Rapid curing allows rapid handling of bonded components
- Deep polymerization
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DOWSIL™ EA-2626 Adhesive
- Two-component adhesive sealant
- Rapid polymerization at room temperature
- Neutral alkoxide polymerization
- Pasty, non-self-levelling consistency
- Good and durable adhesion
- Excellent weather, UV and heat resistance up to 190°C
- Rapid curing allows rapid handling of bonded components
- Deep polymerization
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DOWSIL™ EA-3838 Fast Adhesive
- Fast and homogeneous deep polymerization
- Early adhesion at room temperature
- Pasty, non-self-levelling consistency
- Rapid handling of bonded components
- Fast assembly process
- Durable adhesion to a wide variety of substrates
- Excellent resistance to weathering and U.V. rays.
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EPIBOND® 115 A/B
- High-temperature structural epoxy adhesive
- Two-component epoxy adhesive
- Service up to 149°C (300°F)
- High shear strength on metals and composites
- Thixotropic gap-filling paste
- Contains 125-micron spacer beads
- High Tg
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EPIBOND® 200 A/B
- Flexible epoxy structural adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Good performance retention after environmental aging
- 1:1 mixing ratio by weight and volume
- SVHC-free according to REACH
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EPIBOND® 215 A/B
- High-strength structural epoxy adhesive
- High shear and peel strength
- Gap-filling with thixotropic behavior
- Polymerization at room temperature
- Fast handling strength
- Good performance retention after environmental aging and chemical immersion
- SVHC-free according to REACH
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EPIBOND® 315 A/B
- Two-component epoxy adhesive
- Pasty consistency
- High mechanical strength
- Good adhesion to metals
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EPIBOND® 420 A/B
- Structural applications
- Room temperature curing paste
- High toughness and resilience
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EPIBOND® 8000 FR A/B
- Structural epoxy adhesive, flame retardant
- Self-extinguishing properties according to FAR 25.853
- High shear and peel strength
- Thixotropic gap-filling paste
- Curable from room temperature to elevated temperatures
- Free of halogenated additives and antimony
- No SVHC according to REACH
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EPOCAST® 1617 A/B
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Good mechanical strength-to-density ratio
- Suitable for structural applications
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EPOCAST® 1618 D/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures
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EPOCAST® 1619-1 A/B
- Low density syntactic epoxy adhesive
- Flame retardant and self-extinguishing
- Extrudable but non-sagging after application
- Fast curing at room temperature
- Suitable for potting inserts in honeycomb structures
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EPOCAST® 1626 C1/D2
- Two-component structural epoxy adhesive
- Low-density syntactic formulation
- Designed for structural applications on sandwich panels
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EPOCAST® 1628 A/B
- Ultra-low density epoxy paste
- Flame retardant
- Extrudable and non-sagging
- Sandable and machinable after curing
- Suitable for edge reinforcement and honeycomb structure filling