EPIBOND® 215 A/B

  • High-strength structural epoxy adhesive
  • High shear and peel strength
  • Gap-filling with thixotropic behavior
  • Polymerization at room temperature
  • Fast handling strength
  • Good performance retention after environmental aging and chemical immersion
  • SVHC-free according to REACH

Additional information

Product Type
Brand
Technology
Mecc. polymerization
Color
Temp. min.
Temp. max.
Substrates , ,
Working life
Elastic modulus
Lap shear strength (LSS)
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two-component Yes