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3 Electronics adhesive Electronics adhesive

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DOWSIL™ 93-076 RF Aerospace Sealant

Good tensile strength High adhesive capacity Low thermal conductivity Good resistance to weathering Two-component with room temperature curing Stable even at high temperatures
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DOWSIL™ Q5-8401 Adhesive
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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DOWSIL™ SE 1700 Adhesive
- Mellow
- Two-component - 10:1 mixing ratio
- High tensile strength
- Good processing time after mixing
- Hot polymerization

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