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Araldite® CW 2243-1L
Low viscosity
Flexible jets
Good resistance to thermal shock
Semi-rigid system
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Araldite® CW 2245
Good resistance to temperature shock
Flexible jets
Low viscosity
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Araldite® DBF
Low viscosity casting resin
High possibility of adding filler
Encapsulation of electronic and low-voltage components
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Araldite® XB 2252-1 / XB 2253-1
Good resistance to thermal shock
Good dielectric properties
Good mechanical properties
Excellent thermal resistance
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Arathane® CW 5620
Good thermal resistance
Excellent sliding properties
Good thermal conductivity
Non-abrasive casting system
Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
Two-component resin for high temperature
It cross-links at room temperature but can be accelerated with heat
Halogen-free system
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DOWSIL™ 1-2577 Low VOC Conformal Coating
Cures to an elastoplastic surface
Resilient and abrasion resistant
Solvent-based resin coating
Polymerization at room temperature
The optional thermal acceleration (after solvent wilting)
UV indicator enables automated inspection
Allows use with many low-solids lead-free solder
Reduced VOC content
Emission recovery can be simplified for VOCs in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
Cures to a robust surface
Resilient and abrasion resistant
Solvent-based resin coating
Polymerization at room temperature
Possibility of acceleration after solvent spillage
UV indicator for inspection
Allows use with many low-solids lead-free solder
Low viscosity improves flow and
fill tight spaces and gaps
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DOWSIL™ 3-4150 Dielectric Gel Kit
Green when mixed
Rapid polymerization at room temperature
Reduces the risk of loading errors
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DOWSIL™ 3-4207 Dielectric Tough Gel Kit
When properly mixed, the gel is green
Conditional adhesion without primer at room temperature
Hardened gel for increased mechanical strength
UV indicator enables automatic inspection
Increased flame resistance
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DOWSIL™ 3-6371 UV Gel
UV curing in 1 part
Very soft
Suitable for very low temperatures
Does not require mixing
UV rays for fast processing speed
Polymerization secondary to moisture
The gel remains flexible even at very low temperatures
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DOWSIL™ CN-8760 Thermally Conductive Encapsulant
Low viscosity
Good thermal conductivity
Mixing ratio 1 to 1
Polymerization at room temperature
Easy to mix and use
Good smoothness for fast processing and short cycle times
Promotes heat dissipation
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
Reduces pressure on components
Effectively dissipates heat
Avoids delamination problems
The rapid polymerization
Optimized processing time
Allows for the implementation of complex projects
No additional dielectric barrier required
Allows for quick filling
It is suitable for high-throughput production processes.
Filling allows easy control of the process
Meets certification requirements
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
Polymerization at room temperature
Low viscosity - ease of processing
Self-adhesive - no primer required
Reliable optical performance in difficult conditions
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
One-component adhesive
Thermally conductive
Polymerizes with moisture
Fast drying to the touch
Good adhesion
Self-leveling
Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9157 Conformal Coating
Rapid polymerization in RT, without notches
Medium viscosity
Polymerizes into a soft, low-stress elastomer
Without added solvents
Slight thermal acceleration can speed up in-line processing
Soft coating can improve reliability against stresses
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DOWSIL™ SE 9184 RTV Adhesive
Rapid polymerization in RT, without notches
Not smooth
Higher thermal conductivity
Controlled volatility of silicone
No mixing required
Polymerization at room temperature
Faster processing at room temperature
Used if increased flame resistance is required
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DOWSIL™ SE 9187 L Adhesive
Rapid polymerization
Very low viscosity
Controlled volatility of silicone
Solvent-free
Excellent smoothness, filling or self-leveling after distribution
Polymerizes into a soft, low-stress elastomer
Coating can improve reliability against stresses
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DOWSIL™ SE 9189 L RTV
Rapid polymerization
Sliding
Polymerizes into a soft, low-stress elastomer
Controlled volatility of silicone
No solvent added
Polymerization at room temperature
Faster processing at room temperature with thermal acceleration
Soft coating can improve reliability against stresses
Can be used if flame resistance required
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
Polymerization at room temperature
Long-term performance stability up to 150°C
Low compression stress
Maintains upright position (cured or uncured state)
Controlled volatility of silicone
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