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Showing 1–20 of 58 results

Tipo di prodotto

1 Conductive paints Conductive paints
5 Conformal coating Conformal coating
1 Gap filler Gap filler
4 Gel Gel
3 Heat-conductive adhesive Heat-conductive adhesive
11 Resins and encapsulants Resins and encapsulants
1 Thermal conductive paste Thermal conductive paste

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Applicazioni

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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ARALDITE® 1570 FST A/B
- Two-component epoxy adhesive
- Halogen-free
- Compliant with FST (Flame, Smoke, Toxicity) requirements
- Self-extinguishing
- Thixotropic paste formulation
- Room temperature curing
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ARALDITE® 1641 A/B
- Ultra-low density syntactic epoxy adhesive
- Easily pumpable
- Non-sag after application
- Good resistance to vibrational fatigue
- Designed to reduce cracking tendency in high-stress applications
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ARALDITE® 1644 A/B
- Ultra-low density syntactic epoxy adhesive
- Non-sag
- Designed for edge sealing and void filling
- High compressive strength-to-density ratio
- Manual or extrusion application
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ARALDITE® 501 A/B
- Two-component epoxy adhesive
- Low-viscosity system
- Good substrate wetting
- Room temperature curing
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Araldite® CW 2243-1L
- Low viscosity
- Flexible jets
- Good resistance to thermal shock
- Semi-rigid system
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Araldite® CW 2245
- Good resistance to temperature shock
- Flexible jets
- Low viscosity
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Araldite® DBF
- Low viscosity casting resin
- High possibility of adding filler
- Encapsulation of electronic and low-voltage components
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ARALDITE® LY 1564 SP / ARADUR® 2954
- Two-component epoxy system for composites
- Amine system without reactive diluents
- High flexibility and high reactivity
- Suitable for hot processes
- Good reinforcement impregnation
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ARALDITE® LY 3508 / ARADUR® 22962
- Toughened two-component epoxy system
- Medium resin viscosity
- Good toughness combined with low viscosity
- Suitable for lamination and molding processes
- Heat curing
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ARALDITE® LY 3508 / ARADUR® 3475
- Two-component epoxy system
- Medium-viscosity toughened resin
- Good toughness and mechanical strength
- Suitable for lamination and molding processes
- Heat curing
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ARALDITE® LY 5052 / ARADUR® 5052
- Two-component low-viscosity epoxy system
- Long pot life
- Good reinforcement impregnation
- Room temperature curing with post-cure capability
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ARALDITE® LY 8615 / ARADUR® 8615
- Two-component high-temperature epoxy system
- Low viscosity for RTM, SCRIMP, and VARTM processes
- Long pot life
- High glass transition temperature (Tg > 180 °C with post-cure)
- Suitable for the production of composite parts and molds
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Araldite® XB 2252-1 / XB 2253-1
- Good resistance to thermal shock
- Good dielectric properties
- Good mechanical properties
- Excellent thermal resistance
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Arathane® CW 5620
- Good thermal resistance
- Excellent sliding properties
- Good thermal conductivity
- Non-abrasive casting system
- Good resistance to thermal shock
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Arathane® CW 5620 / Arathane® HY 5610
- Two-component resin for high temperature
- It cross-links at room temperature but can be accelerated with heat
- Halogen-free system
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CG 1305 A/B
- Two-component syntactic epoxy system
- Medium density and low specific weight
- High mechanical strength
- Pourable
- Designed for honeycomb structure reinforcement and potting
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DOWSIL™ 1-2577 Low VOC Conformal Coating
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- The optional thermal acceleration (after solvent wilting)
- UV indicator enables automated inspection
- Allows use with many low-solids lead-free solder
- Reduced VOC content
- Emission recovery can be simplified for VOCs in some U.S. states
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to a robust surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- Possibility of acceleration after solvent spillage
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low viscosity improves flow and
- fill tight spaces and gaps
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DOWSIL™ 3-4150 Dielectric Gel Kit
- Green when mixed
- Rapid polymerization at room temperature
- Reduces the risk of loading errors
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DOWSIL™ 3-4207 Dielectric Tough Gel Kit
- When properly mixed, the gel is green
- Conditional adhesion without primer at room temperature
- Hardened gel for increased mechanical strength
- UV indicator enables automatic inspection
- Increased flame resistance