Products
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Tipo di prodotto
- 1 Anaerobic activator
- 9 Anaerobic adhesive
- 23 Anti friction coating
- 8 Cleaner
- 2 Cleaners
- 5 Compound
- 1 Conductive paints
- 19 Conformal coating
- 7 Dispersions
- 49 Elastomeric adhesive
- 5 Electrically conductive adhesives
- 16 Electronics adhesive
- 2 Gap filler
- 8 Gel
- 93 Greases
- 10 Heat-conductive adhesive
- 3 Hot-Melt Stickers
- 7 Instant adhesive
- 72 Oils
- 20 Pastes
- 13 Primer
- 31 Resins and encapsulants
- 3 Solid lubricant
- 2 special
- 40 Structural adhesive
- 6 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
-
- No solvent added
- Polymerization at room temperature
- Slight thermal acceleration can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
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- No solvent added
- Polymerization at room temperature
- It can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Improves reliability against stresses
- Promotes flow and filling of narrow spaces and crevices
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- Green when mixed
- Rapid polymerization at room temperature
- Reduces the risk of loading errors
-
- When properly mixed, the gel is green
- Conditional adhesion without primer at room temperature
- Hardened gel for increased mechanical strength
- UV indicator enables automatic inspection
- Increased flame resistance
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- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Good mechanical strength
- Contains UV indicator for inspection
- Adhesion without the use of primer
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
-
- Addition curing system
- Cures into a durable and flexible rubber
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Rapid thermal polymerization
- Excellent heat resistance (up to 250ºC)
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- UV curing in 1 part
- Very soft
- Suitable for very low temperatures
- Does not require mixing
- UV rays for fast processing speed
- Polymerization secondary to moisture
- The gel remains flexible even at very low temperatures
-
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
-
- Medium hardness (Shore 00)
- Promotes application on sloping surfaces
- Easy to use
- Mixing ratio
- Rapid polymerization at room temperature
- It does not require temporary storage of the
- equipped parts
- Low compression set maintained at high service temperatures
- Stable and flexible over a wide range of temperatures
-
- Medium hardness (Shore 00)
- Reduced flow favors application on sloping surfaces
- Easy to use, handy 1:1 mixing ratio
- Rapid curing at room temperature, with no need for temporary storage of the equipped parts
- Low compression set that is maintained at high service temperatures service temperatures
- Stable and flexible over a wide range of temperatures
-
- Single-component
- Does not require mixing
- Good fluidity
- Capable of flowing, filling or self-leveling
- Polymerization at room temperature
- No solvent added
- UV indicator for manual and automatic inspections
-
- Mellow
- High tensile strength and elongation resistance
- High thermal stability
- Single component - Does not require mixing
- Polymerization at room temperature
-
- Mellow
- Polymerization in rapid RTV
- Good "green" resistance
- Single-component - No mixing required
- Polymerization at room temperature
- Fast skin time
- High self-extinguishing
-
- Not smooth
- Moderate thermal conductivity
- Does not require ovens or curing
- Heat flow away from circuit components can increase reliability
-
- Rapid digestion of cured silicone sealant
- Non-halogenated solvent
- Non-flammable
-
- Adhesion to metals and plastics
- Weathering resistance
- UV resistance
- Non-corrosive
- Neutral polymerization
- Not oily
- Ready to use
- Short time of no adherence
- Solvent-free: low shrinkage
- Good mechanical properties: high
- Tear resistance
- Elongation resistance
- Tensile strength
-
- Not smooth
- Low levels of volatile condensable materials
- High elongation for greater stress reduction
- No mixing required
- Faster inline machining with optional thermal acceleration
- Proven for space applications
-
- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Excellent adhesion to many substrates
- Stable and flexible from -40°C (-40°F) to 180°C (356°F)
-
- Provides instant green force
- Easy-to-use one-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Pasty and non-sticky consistency
- Cures into a durable and flexible rubber
- Stable and flexible from -50°C to +150°C
- UL 94 HB
- Rapid resistance formation promotes increased productivity due to rapid handling of bonded units
- Saves time because no buffer is needed for increasing resistance
-
- One-component adhesive sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy polymerization system
- Pasty consistency, does not bag
- Easy to apply
- Low modulus for high movement capacity
- Good adhesion on many substrates
- Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
