Dowsil

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Tecnologia

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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DOWSIL™ Q4-2805 Fluorosilicone Channel Sealant
- Superior sealing characteristics when exposed to fuels and oils
- Easily injected and reinjected
- Does not harden
- Good grip
- Essentially unaffected by shock, vibration, and thermal cycling
- Contains no hardeners or curing agents
- Withstands immersion in fuels and exposure to fuel vapors at temperatures up to +200°C
- Contains flow control particles
- Excellent flow characteristics allow faster injection at lower pressures.
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DOWSIL™ Q5-8401 Adhesive
- Two-component - Mixing ratio 1:1
- Hot polymerization
- High tensile strength
- Good processing time after mixing
- No solvent added
- Fast and versatile polymerization controlled by temperature
- Self-leveling
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DOWSIL™ SC 102 Compound
- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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DOWSIL™ SE 1700 Adhesive
- Mellow
- Two-component - 10:1 mixing ratio
- High tensile strength
- Good processing time after mixing
- Hot polymerization
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DOWSIL™ SE 4420
- Polymerization at room temperature
- Good adhesion on various substrates
- Fast tack-free time
- Elastomeric material with high elongation
- Suitable for bonding, sealing and thermal dissipation
- Good mechanical strength
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DOWSIL™ SE 4486 Thermally Conductive Adhesive
- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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DOWSIL™ SE 9120 S
- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
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DOWSIL™ SE 9157 Conformal Coating
- Rapid polymerization in RT, without notches
- Medium viscosity
- Polymerizes into a soft, low-stress elastomer
- Without added solvents
- Slight thermal acceleration can speed up in-line processing
- Soft coating can improve reliability against stresses
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DOWSIL™ SE 9184 RTV Adhesive
- Rapid polymerization in RT, without notches
- Not smooth
- Higher thermal conductivity
- Controlled volatility of silicone
- No mixing required
- Polymerization at room temperature
- Faster processing at room temperature
- Used if increased flame resistance is required
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DOWSIL™ SE 9185
- Rapid polymerization in RT
- Mellow
- High elongation
- Controlled volatility of silicone
- Single-component - No mixing required
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DOWSIL™ SE 9186 Sealant
- Volatility-controlled silicone
- Polymerizes into a soft and elastic elastomer
- No solvent added
- Single-component - No mixing required
- Polymerization at room temperature
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DOWSIL™ SE 9187 L Adhesive
- Rapid polymerization
- Very low viscosity
- Controlled volatility of silicone
- Solvent-free
- Excellent smoothness, filling or self-leveling after distribution
- Polymerizes into a soft, low-stress elastomer
- Coating can improve reliability against stresses
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DOWSIL™ SE 9188 RTV Adhesive
- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0
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DOWSIL™ SE 9189 L RTV
- Rapid polymerization
- Sliding
- Polymerizes into a soft, low-stress elastomer
- Controlled volatility of silicone
- No solvent added
- Polymerization at room temperature
- Faster processing at room temperature with thermal acceleration
- Soft coating can improve reliability against stresses
- Can be used if flame resistance required
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DOWSIL™ Silicone AP Adhesive Sealant
- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Good adhesion on many substrates
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DOWSIL™ TC-4025 Dispensable Thermal Pad
- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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DOWSIL™ TC-4515 Gap Filler A&B
- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
- Polymerization at room temperature
- Long-term performance stability up to 150°C
- Low compression stress
- Maintains upright position (cured or uncured state)
- Controlled volatility of silicone
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DOWSIL™ TC-5026 Thermally Conductive Compound
- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components