≤200 °C

    • General purpose thermal management paste
    • Excellent stability under a wide range of conditions
    • Silicone oil-based
    • Wide operating temperature range
    • Good thermal conductivity
    • Use as a thermal interface material
    • Non-curing paste
    • Allows rework of components
    • Thermal conductivity at elevated temperatures
    • Very low oil separation
    • Excellent anti-creep characteristics
    • Wide range of operating temperatures
    • Low evaporation weight loss
    • Optimal heat dissipation efficiency
    • Also facilitates application by screen printing
    • Non-hardening paste
    • Allows for easy rework
    • Increased adhesion strength
    • Can be used as a sealant or thermal adhesive
    • High thermal conductivity
    • Combines adhesive and heat dissipation properties
    • Very wide operating temperature range
    • Single-component
    • Not lumpy
    • Ideal if high viscosity product required