≤200 °C

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Very low surface energy
    • Repels hydrocarbon and silicone oils
    • Low solids content
    • Low film strength once cured
    • Connectors do not require masking
    • Promotes economical and efficient application
    • Fast drying time
    • Simple coating procedure
    • Non-flammable coating that contains a UV trace
    • Ensures the quality of the coating by visual inspection
    • General purpose thermal management paste
    • Excellent stability under a wide range of conditions
    • Silicone oil-based
    • Wide operating temperature range
    • Good thermal conductivity
    • Use as a thermal interface material
    • Non-curing paste
    • Allows rework of components
    • Thermal conductivity at elevated temperatures
    • Very low oil separation
    • Excellent anti-creep characteristics
    • Wide range of operating temperatures
    • Low evaporation weight loss
    • Optimal heat dissipation efficiency
    • Also facilitates application by screen printing
    • Non-hardening paste
    • Allows for easy rework
    • Increased adhesion strength
    • Can be used as a sealant or thermal adhesive
    • High thermal conductivity
    • Combines adhesive and heat dissipation properties
    • Very wide operating temperature range
    • Single-component
    • Not lumpy
    • Ideal if high viscosity product required