18
Showing all 8 results
Filtri
Tipo di prodotto
- 1 Electronics adhesive
- 1 Heat-conductive adhesive
- 4 Resins and encapsulants
- 2 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- Good resistance to temperature shock
- Flexible jets
- Low viscosity
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- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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- Mellow
- High tensile strength and elongation resistance
- High thermal stability
- Single component - Does not require mixing
- Polymerization at room temperature
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- General purpose thermal management paste
- Excellent stability under a wide range of conditions
- Silicone oil-based
- Wide operating temperature range
- Good thermal conductivity
- Use as a thermal interface material
- Non-curing paste
- Allows rework of components
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- Thermal conductivity at elevated temperatures
- Very low oil separation
- Excellent anti-creep characteristics
- Wide range of operating temperatures
- Low evaporation weight loss
- Optimal heat dissipation efficiency
- Also facilitates application by screen printing
- Non-hardening paste
- Allows for easy rework
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- Excellent electrical properties
- Low dielectric constant
- Excellent resistance to seawater
- Very low viscosity
- Rugged and tear-resistant
- Low water absorption
- Excellent resistance to oxidation
- Excellent adhesion
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- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available
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- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
