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- 1 Thermal conductive paste
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Tecnologia
Applicazioni
The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
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- High thermal conductivity
- Optimal heat dissipation
- Low viscosity for easy application
- Used as thermal interface material
- Based on a non-silicone oil
- Avoids migration problems of silicone and siloxane LMW
- Non-curing paste
- Enables simple and efficient rework of components
