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Tipo di prodotto
- 1 Heat-conductive adhesive
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Tecnologia
Applicazioni
The data on this page are to be considered purely indicative and do not constitute a technical data sheet.
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- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
