Resins and encapsulants

Showing 21–31 of 31 results

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31 Resins and encapsulants Resins and encapsulants

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Electrolube UR5118 Polyurethane Resin
- Excellent electrical properties
- Low dielectric constant
- Excellent resistance to seawater
- Very low viscosity
- Rugged and tear-resistant
- Low water absorption
- Excellent resistance to oxidation
- Excellent adhesion
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Electrolube UR5528 Polyurethane Resin
- High degree of toughness
- Adhesion to a wide variety of substrates
- Easy application
- Perfect where moisture ingress is a problem
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Electrolube UR5608 Polyurethane Resin
- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available
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Electrolube UR5634 Polyurethane Resin
- Durable, low-viscosity system
- Ideal for encapsulation of LEDs
- Mixing ratio 1:1 by volume
- Promotes ease of processing
- Does not contain IPDI; low-risk material
- Resists water and mold growth
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Electrolube UR5635 Polyurethane Resin
- Durable and low viscosity
- Ideal for LED applications
- Mixing ratio 1:1 by volume
- Does not contain IPDI; low-risk material
- Suitable for a wide range of environments
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SYLGARD™ 160 Silicone Elastomer Kit
- Gray fluid encapsulant
- Room temperature or hot curing
- Fast and versatile curing process
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 164 Silicone Elastomer Kit
- Fast and versatile polymerization, controlled by temperature
- Good dielectric properties
- Moderate thermal conductivity
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SYLGARD™ 170 Silicone Elastomer Kit
- Low viscosity
- High open time
- Moderate thermal conductivity
- Polymerization at room temperature
- Easy to apply
- Stable and flexible over a wide temperature range
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SYLGARD™ 184 Silicone Elastomer Kit

Medium viscosity High open time Good dielectric properties High transparency Polymerization at room temperature Accelerable with heat input Stable and flexible over a wide temperature range Good flame resistance
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SYLGARD™ 567 Primerless Silicone Encapsulant Kit
- Mixing ratio 1 to 1
- Sliding
- Self-priming
- No further priming is necessary
- Fast and versatile polymerization controlled by temperature
- Fluidity and filling in confined spaces and around complex geometries
- Good dielectric properties
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SYLGARD™ Q3-3600 Thermally Conductive Encapsulant
- Heat-conductive encapsulant
- 2 parts
- Fluid, self-leveling
- Long processing time at room temperature
- Temperature-controlled polymerization
- Increases reliability