Thermal conductive paste
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Tipo di prodotto
- 6 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
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- High thermal conductivity
- Optimal heat dissipation
- Low viscosity for easy application
- Used as thermal interface material
- Based on a non-silicone oil
- Avoids migration problems of silicone and siloxane LMW
- Non-curing paste
- Enables simple and efficient rework of components
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- General purpose thermal management paste
- Excellent stability under a wide range of conditions
- Silicone oil-based
- Wide operating temperature range
- Good thermal conductivity
- Use as a thermal interface material
- Non-curing paste
- Allows rework of components
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- Thermal conductivity at elevated temperatures
- Very low oil separation
- Excellent anti-creep characteristics
- Wide range of operating temperatures
- Low evaporation weight loss
- Optimal heat dissipation efficiency
- Also facilitates application by screen printing
- Non-hardening paste
- Allows for easy rework
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- Increased adhesion strength
- Can be used as a sealant or thermal adhesive
- High thermal conductivity
- Combines adhesive and heat dissipation properties
- Very wide operating temperature range
- Single-component
- Not lumpy
- Ideal if high viscosity product required
