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2 Gel Gel
3 Resins and encapsulants Resins and encapsulants

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Araldite® DBF
- Low viscosity casting resin
- High possibility of adding filler
- Encapsulation of electronic and low-voltage components
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DOWSIL™ 3-4150 Dielectric Gel Kit
- Green when mixed
- Rapid polymerization at room temperature
- Reduces the risk of loading errors
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DOWSIL™ 3-4241 Dielectric Tough Gel Kit
- Slow-curing two-component silicone dielectric gel
- Good flame resistance
- Good mechanical strength
- Contains UV indicator for inspection
- Adhesion without the use of primer
- Cures extremely softly
- Designed to insulate circuits from the damaging effects of moisture
- Provides electrical insulation for high voltages
- Protects circuits and interconnections from thermal stresses
- Low viscosity
- Odorless
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Electrolube UR5634 Polyurethane Resin
- Durable, low-viscosity system
- Ideal for encapsulation of LEDs
- Mixing ratio 1:1 by volume
- Promotes ease of processing
- Does not contain IPDI; low-risk material
- Resists water and mold growth
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Electrolube UR5635 Polyurethane Resin
- Durable and low viscosity
- Ideal for LED applications
- Mixing ratio 1:1 by volume
- Does not contain IPDI; low-risk material
- Suitable for a wide range of environments

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