Structural adhesive
Showing 1–20 of 95 results
Filtri

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- Two-component epoxy adhesive
- Halogen-free
- Compliant with FST (Flame, Smoke, Toxicity) requirements
- Self-extinguishing
- Thixotropic paste formulation
- Room temperature curing
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- Ultra-low density syntactic epoxy adhesive
- Easily pumpable
- Non-sag after application
- Good resistance to vibrational fatigue
- Designed to reduce cracking tendency in high-stress applications
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- Ultra-low density syntactic epoxy adhesive
- Non-sag
- Designed for edge sealing and void filling
- High compressive strength-to-density ratio
- Manual or extrusion application
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- High resistance to cutting and stripping
- Hard and resilient
- Good resistance to dynamic load
- Combines a wide range of commonly used materials
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- High resistance to cutting and stripping
- Hard and resilient
- Rapid polymerization
- Combines a wide range of materials
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- Two-component epoxy adhesive for fast bonding
- Versatile solution for general-purpose applications
- Suitable for bonding a wide variety of materials
- High strength and toughness
- Fluid consistency for easy application
- Also suitable for potting small components
- Formulated without intentionally added BPA
- Not subject to CMR labeling
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- Cures at room temperature
- High strength and toughness
- Thixotropic
- Good environmental and chemical resistance
- Metal bonding
- Bonding of commonly used materials
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- Two-component epoxy adhesive for high-strength bonding
- Specifically designed for bonding metals and rigid materials
- Good resistance to environmental and chemical agents
- Suitable for vertical applications thanks to its sag resistance
- Suitable for multi-material bonding
- High strength and toughness
- Suitable for gap filling
- Formulated without intentionally added BPA
- Not subject to CMR labeling
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- Resistance to high temperatures
- Resistant to chemicals
- Water resistant
- Resistant to chemicals
- It fills the games
- It does not drip down to 5 mm
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- Two-component epoxy adhesive for durable bonds
- High resistance to high temperatures
- High resistance to chemicals and harsh environmental conditions
- Low shrinkage for durable bonding
- Suitable for filling gaps up to 5 mm
- Formulated without intentionally added BPA
- Not subject to CMR labeling
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- Tenacious
- Ideal for bonding GRP, SMC and dissimilar substrates
- Fills in gaps, does not drip up to 10 mm thick
- Good resistance to weathering
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- Two-component toughened epoxy adhesive
- High toughness for durable and resilient joints
- Resistant to dynamic loads and vibrations
- Particularly suitable for bonding GRP, SMC, and dissimilar materials
- Good resistance to environmental conditions
- Thixotropic and sag-resistant
- High gap-filling properties
- Formulated without intentionally added BPA
- Not subject to CMR labeling
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- Good adhesion on plastics
- Flexible
- Cures at room temperature
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- High shear strength
- Paste a wide variety of materials (metal, composites, and thermoplastics)
- Resistant to temperatures up to 140°C
- Extremely tenacious and resilient adhesive
- Contains spacers to ensure a minimum bond line thickness of 0.05 mm
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- Low viscosity, transparent adhesive
- Especially suitable for joining glass and ceramics
- Suitable for transparent materials
- Glass-like refractive index
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- Two-component transparent and colorless epoxy adhesive
- Low viscosity for high flowability
- Particularly suitable for bonding glass and ceramic
- Suitable for transparent casting, laminates and component encapsulation
- Refractive index similar to glass
- Good water resistance
- Suitable for transparent assemblies and electronic applications
- Formulated without intentionally added BPA
- Not subject to CMR labeling
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- Rapid polymerization
- Tenacious
- Multipurpose
- Excellent adhesion to a wide range of plastics, composites, and metals
- Suitable for temperatures up to 100 °C
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- Excellent processing time/cure time ratio
- Tenacious
- Multipurpose
- Tolerant to "suboptimal" pretreatment
- Filling spaces up to 4 mm
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- Transparent
- Fast curing
- UV stable
- Suitable for bonding plastics and metals
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- Thixotropic, non-sagging
- Tenacious and resilient adhesive
- Suitable for bonding metals and composites
- High resistance to weathering
- Provides an adhesion thickness of 0.05 mm















