Thixotropic
Showing all 9 results
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Tipo di prodotto
- 9 Elastomeric adhesive
Marchio
Tecnologia
Applicazioni
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- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Alkoxyl polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Excellent adhesion to many substrates
- Stable and flexible from -40°C (-40°F) to 180°C (356°F)
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- Provides instant green force
- Easy-to-use one-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Excellent adhesion to a wide range of substrates such as glass, metals and plastics
- Pasty and non-sticky consistency
- Cures into a durable and flexible rubber
- Stable and flexible from -50°C to +150°C
- UL 94 HB
- Rapid resistance formation promotes increased productivity due to rapid handling of bonded units
- Saves time because no buffer is needed for increasing resistance
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- One-component adhesive sealant
- Cures at room temperature when exposed to moisture in the air
- Alkoxy polymerization system
- Pasty consistency, does not bag
- Easy to apply
- Low modulus for high movement capacity
- Good adhesion on many substrates
- Stable and flexible from -50°C (-58°F) to +180°C (+356°F)
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- One-component fluorosilicone sealant adhesive.
- It cures at room temperature when
- exposed to moisture in the air
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -65°C (-85°F) to 260°C (500°F)
- Retains its properties when exposed to fuels, oils and solvents
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- One-component adhesive sealant
- Cures at room temperature when exposed to air humidity
- Acetoxy polymerization system
- Pasty and non-sagging consistency
- Easy to apply
- Cures into a durable and flexible rubber
- Good adhesion to many substrates
- Stable and flexible from -60°C to +180°C (-76°F to +356°F), with short peaks up to +205°C (401°F)
- Black version: stable and flexible from -60°C to +205°C (-76°F to +401°F), with short peaks up to +230°C (446°F)
- Excellent dielectric properties
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- Not smooth
- Polymerization at room temperature
- High elongation for greater stress reduction
- No mixing required
- Polymerization at room temperature, no need for ovens
- Faster inline machining with optional thermal acceleration
- Improved reliability through reduced curing stresses
- Automated or manual needle dispensing systems
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- Fast and homogeneous deep polymerization
- Early adhesion at room temperature
- Pasty, non-self-levelling consistency
- Rapid handling of bonded components
- Fast assembly process
- Durable adhesion to a wide variety of substrates
- Excellent resistance to weathering and U.V. rays.
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- Very high initial adhesion
- Free of solvents, isocyanates and silicones
- Adjustable
- Complete and rapid curing
- Very high mechanical strength
- Excellent sealing properties
- Very wide range of adhesion
- Odorless
- Compatible with paints
- Chemically neutral polymerization
- Short-term resistant up to +200°C for powders and thermal coatings.
- Thermal
- Non-corrosive on surfaces
- Shock and vibration resistant (absorbs shock)
- Resists thermal expansion and material tension
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- Simple processing
- Easy finishing and cleaning
- Free of solvents, isocyanates and silicones
- Wide spectrum of adhesion
- Odorless
- Compatible with paints
- Excellent sealing properties
