<1,000 mPa.s

    • Green when mixed
    • Rapid polymerization at room temperature
    • Reduces the risk of loading errors
    • When properly mixed, the gel is green
    • Conditional adhesion without primer at room temperature
    • Hardened gel for increased mechanical strength
    • UV indicator enables automatic inspection
    • Increased flame resistance
    • Slow-curing two-component silicone dielectric gel
    • Good flame resistance
    • Good mechanical strength
    • Contains UV indicator for inspection
    • Adhesion without the use of primer
    • Cures extremely softly
    • Designed to insulate circuits from the damaging effects of moisture
    • Provides electrical insulation for high voltages
    • Protects circuits and interconnections from thermal stresses
    • Low viscosity
    • Odorless
    • UV curing in 1 part
    • Very soft
    • Suitable for very low temperatures
    • Does not require mixing
    • UV rays for fast processing speed
    • Polymerization secondary to moisture
    • The gel remains flexible even at very low temperatures
    • Rapid polymerization
    • Suitable for very low temperatures
    • Rapid thermal polymerization to speed up processing
    • Gel remains flexible in ultra-low temperature applications
    • General use
    • Low viscosity
    • Addition curing system
    • No polymerization by-products
    • Self-healing gel
    • Permanent pressure-sensitive adhesion
    • Excellent dielectric properties
    • Long-term sealing against atmospheric contaminants
    • Seals and protects PCBs and electronic devices
    • Used for delicate electrical devices
    • Offers excellent flexibility
    • Cures even at room temperature
    • Isolate circuits from harmful effects
    • Special class of encapsulants
    • Polymerizes into an extremely soft material
    • Protects circuits and interconnections
    • Operational over a wide temperature range