>100,000 / <250,000 mPa.s
Showing all 15 results
Filtri

Tipo di prodotto
- 1 Conductive paints
- 1 Electrically conductive adhesives
- 1 Gap filler
- 3 Heat-conductive adhesive
- 3 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- One-component adhesive
- Thermally conductive
- Polymerizes with moisture
- Fast drying to the touch
- Good adhesion
- Self-leveling
- Controlled volatility (controlled migration of silanes)
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- Can be used as a printable PAD
- Can replace the traditional manufactured pad
- Use as a gap filler
- Dispensed or printed through manual or automated processes
- Deposit of features for precise coverage of components
- Lower cost of ownership than manufactured pads
- Excellent thermal performance
- Soft, stress-relieving and shock-dampening
- Reworkable
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- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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- Solvent-free formulation
- Sliding
- Does not polymerize
- Able to achieve bond line thickness
- Very low thermal resistance
- High thermal conductivity
- Wicks heat away from sensitive components
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- High thermal conductivity
- Optimal heat dissipation
- Low viscosity for easy application
- Used as thermal interface material
- Based on a non-silicone oil
- Avoids migration problems of silicone and siloxane LMW
- Non-curing paste
- Enables simple and efficient rework of components
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- General purpose thermal management paste
- Excellent stability under a wide range of conditions
- Silicone oil-based
- Wide operating temperature range
- Good thermal conductivity
- Use as a thermal interface material
- Non-curing paste
- Allows rework of components
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- Increased adhesion strength
- Can be used as a sealant or thermal adhesive
- High thermal conductivity
- Combines adhesive and heat dissipation properties
- Very wide operating temperature range
- Single-component
- Not lumpy
- Ideal if high viscosity product required
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- Thermal conductivity of 0.8 W/(m-K)
- Mixing ratio 1:1
- Fire retardant - UL 94V-0 registered
- Processing time: 5 minutes
- Laying time: 15 minutes
- Provides strong electrical insulation
- Low CTE before Tg
- High tensile and compressive strength
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
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- High electrical conductivity
- Convenient 1-to-1 mixing ratio
- Processing time: 20 minutes
- Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
- Creates strong permanent electrical connections
- Polymerization at room temperature
- Without SVHC
- Excellent adhesion to many substrates
- Storage at room temperature
- Long shelf life
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
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- Provides >52 dB RFI shielding at frequencies <1 MHz
- Excellent adhesion to plastics
- Strong corrosion resistance
- Gentle solvent system, safe on polystyrenes
- HAP-free: does not contain toluene or xylene
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- UL Recognized (File No. E202609)
- Provides effective EMI/RFI shielding over a wide range of frequencies
- Strong corrosion resistance
- Gentle and safe solvent system on polystyrenes
- HAP free-does not contain toluene, xylene, or MEK
- Available in aerosol format
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- Good conductivity
- Provides good RFI shielding
- Extreme durability and grip
- Strong resistance to solvents
- Excellent corrosion and salt spray resistance
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- Provides effective EMF shielding
- Ideal for wood and drywall
- Ideal for shielding the cavities of electric guitars
- Non-flammable and without harmful odors
- Low VOC content
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- Provides excellent EMI/RFI shielding over a wide frequency range
- Non-flammable and without harmful odors
- Shipping as non-DG by air
- Low VOC content
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- High thermal conductivity
- No mixing is required before use
- Provides strong electrical insulation
- Low curing temperature (<100 °C)
- Storage at room temperature (≤ 22 °C)
- Binds well to a wide variety of substances
- Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons












