>100,000 / <250,000 mPa.s

    • One-component adhesive
    • Thermally conductive
    • Polymerizes with moisture
    • Fast drying to the touch
    • Good adhesion
    • Self-leveling
    • Controlled volatility (controlled migration of silanes)
    • Can be used as a printable PAD
    • Can replace the traditional manufactured pad
    • Use as a gap filler
    • Dispensed or printed through manual or automated processes
    • Deposit of features for precise coverage of components
    • Lower cost of ownership than manufactured pads
    • Excellent thermal performance
    • Soft, stress-relieving and shock-dampening
    • Reworkable
    • Mixing ratio mixture 1:1
    • Thermally conductive silicone
    • Platinum curing system
    • Polymerization at room temperature
    • Provides long-term stability
    • Polymerizes without exothermia
    • Thixotropic, non-sagging
    • Resistant to ozone and ultraviolet degradation
    • Provides high cooling performance
    • Solvent-free formulation
    • Sliding
    • Does not polymerize
    • Able to achieve bond line thickness
    • Very low thermal resistance
    • High thermal conductivity
    • Wicks heat away from sensitive components
    • High thermal conductivity
    • Optimal heat dissipation
    • Low viscosity for easy application
    • Used as thermal interface material
    • Based on a non-silicone oil
    • Avoids migration problems of silicone and siloxane LMW
    • Non-curing paste
    • Enables simple and efficient rework of components
    • General purpose thermal management paste
    • Excellent stability under a wide range of conditions
    • Silicone oil-based
    • Wide operating temperature range
    • Good thermal conductivity
    • Use as a thermal interface material
    • Non-curing paste
    • Allows rework of components
    • Increased adhesion strength
    • Can be used as a sealant or thermal adhesive
    • High thermal conductivity
    • Combines adhesive and heat dissipation properties
    • Very wide operating temperature range
    • Single-component
    • Not lumpy
    • Ideal if high viscosity product required
    • Thermal conductivity of 0.8 W/(m-K)
    • Mixing ratio 1:1
    • Fire retardant - UL 94V-0 registered
    • Processing time: 5 minutes
    • Laying time: 15 minutes
    • Provides strong electrical insulation
    • Low CTE before Tg
    • High tensile and compressive strength
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons"
    • High electrical conductivity
    • Convenient 1-to-1 mixing ratio
    • Processing time: 20 minutes
    • Cure time: 6 hours at room temperature or 10 minutes at 65 °C (149 °F)
    • Creates strong permanent electrical connections
    • Polymerization at room temperature
    • Without SVHC
    • Excellent adhesion to many substrates
    • Storage at room temperature
    • Long shelf life
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons
    • Provides >52 dB RFI shielding at frequencies <1 MHz
    • Excellent adhesion to plastics
    • Strong corrosion resistance
    • Gentle solvent system, safe on polystyrenes
    • HAP-free: does not contain toluene or xylene
    • UL Recognized (File No. E202609)
    • Provides effective EMI/RFI shielding over a wide range of frequencies
    • Strong corrosion resistance
    • Gentle and safe solvent system on polystyrenes
    • HAP free-does not contain toluene, xylene, or MEK
    • Available in aerosol format
    • Good conductivity
    • Provides good RFI shielding
    • Extreme durability and grip
    • Strong resistance to solvents
    • Excellent corrosion and salt spray resistance
    • Provides effective EMF shielding
    • Ideal for wood and drywall
    • Ideal for shielding the cavities of electric guitars
    • Non-flammable and without harmful odors
    • Low VOC content
    • Provides excellent EMI/RFI shielding over a wide frequency range
    • Non-flammable and without harmful odors
    • Shipping as non-DG by air
    • Low VOC content
    • High thermal conductivity
    • No mixing is required before use
    • Provides strong electrical insulation
    • Low curing temperature (<100 °C)
    • Storage at room temperature (≤ 22 °C)
    • Binds well to a wide variety of substances
    • Strong resistance to moisture, salt water, light bases and aliphatic hydrocarbons