Thixotropic

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    • Two-component epoxy adhesive
    • Halogen-free
    • Compliant with FST (Flame, Smoke, Toxicity) requirements
    • Self-extinguishing
    • Thixotropic paste formulation
    • Room temperature curing
    • Ultra-low density syntactic epoxy adhesive
    • Easily pumpable
    • Non-sag after application
    • Good resistance to vibrational fatigue
    • Designed to reduce cracking tendency in high-stress applications
    • Cures at room temperature
    • High strength and toughness
    • Thixotropic
    • Good environmental and chemical resistance
    • Metal bonding
    • Bonding of commonly used materials
    • Two-component epoxy adhesive for high-strength bonding
    • Specifically designed for bonding metals and rigid materials
    • Good resistance to environmental and chemical agents
    • Suitable for vertical applications thanks to its sag resistance
    • Suitable for multi-material bonding
    • High strength and toughness
    • Suitable for gap filling
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • Resistance to high temperatures
    • Resistant to chemicals
    • Water resistant
    • Resistant to chemicals
    • It fills the games
    • It does not drip down to 5 mm
    • Two-component epoxy adhesive for durable bonds
    • High resistance to high temperatures
    • High resistance to chemicals and harsh environmental conditions
    • Low shrinkage for durable bonding
    • Suitable for filling gaps up to 5 mm
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • Tenacious
    • Ideal for bonding GRP, SMC and dissimilar substrates
    • Fills in gaps, does not drip up to 10 mm thick
    • Good resistance to weathering
    • Two-component toughened epoxy adhesive
    • High toughness for durable and resilient joints
    • Resistant to dynamic loads and vibrations
    • Particularly suitable for bonding GRP, SMC, and dissimilar materials
    • Good resistance to environmental conditions
    • Thixotropic and sag-resistant
    • High gap-filling properties
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • High shear strength
    • Paste a wide variety of materials (metal, composites, and thermoplastics)
    • Resistant to temperatures up to 140°C
    • Extremely tenacious and resilient adhesive
    • Contains spacers to ensure a minimum bond line thickness of 0.05 mm
    • Rapid polymerization
    • Tenacious
    • Multipurpose
    • Excellent adhesion to a wide range of plastics, composites, and metals
    • Suitable for temperatures up to 100 °C
    • Excellent processing time/cure time ratio
    • Tenacious
    • Multipurpose
    • Tolerant to "suboptimal" pretreatment
    • Filling spaces up to 4 mm
    • Thixotropic, non-sagging
    • Tenacious and resilient adhesive
    • Suitable for bonding metals and composites
    • High resistance to weathering
    • Provides an adhesion thickness of 0.05 mm
    • Gel
    • Good bonding characteristics on a variety of plastics and materials
    • Filler up to 8mm
    • Tough flexible adhesive suitable for dynamic stresses
    • Two-component epoxy system
    • FST Properties (Fire, Smoke, Toxicity)
    • Intrinsically flame retardant
    • Low viscosity for infusion and RTM processes
    • Heat curing
    • High mechanical performance
    • Two-component epoxy adhesive
    • Low-viscosity system
    • Good substrate wetting
    • Room temperature curing
    • Two-component epoxy adhesive for high-strength industrial bonding
    • High chemical resistance
    • Excellent performance at high temperatures
    • Suitable for aggressive operating environments
    • Thixotropic and suitable for gap filling
    • Suitable for multi-material bonding
    • Suitable for heavy-duty industrial applications
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • Cures at room temperature
    • High strength and toughness
    • Thixotropic
    • Good environmental and chemical resistance
    • Metal bonding
    • Bonding of commonly used materials
    • Thixotropic, non-sagging
    • Tenacious and resilient adhesive
    • Suitable for bonding metals and composites
    • High resistance to weathering
    • Provides an adhesion thickness of 0.05 mm
    • Tenacious
    • Ideal for bonding GRP, SMC and dissimilar substrates
    • Fills in gaps, does not drip up to 10 mm thick
    • Good resistance to weathering
    • Resistance to high temperatures
    • Resistant to chemicals
    • Water resistant
    • Resistant to chemicals
    • It fills the games
    • It does not drip down to 5 mm