Thixotropic

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

    • Two-component epoxy adhesive
    • Halogen-free
    • Compliant with FST (Flame, Smoke, Toxicity) requirements
    • Self-extinguishing
    • Thixotropic paste formulation
    • Room temperature curing
    • Ultra-low density syntactic epoxy adhesive
    • Easily pumpable
    • Non-sag after application
    • Good resistance to vibrational fatigue
    • Designed to reduce cracking tendency in high-stress applications
    • Cures at room temperature
    • High strength and toughness
    • Thixotropic
    • Good environmental and chemical resistance
    • Metal bonding
    • Bonding of commonly used materials
    • Resistance to high temperatures
    • Resistant to chemicals
    • Water resistant
    • Resistant to chemicals
    • It fills the games
    • It does not drip down to 5 mm
    • Tenacious
    • Ideal for bonding GRP, SMC and dissimilar substrates
    • Fills in gaps, does not drip up to 10 mm thick
    • Good resistance to weathering
    • High shear strength
    • Paste a wide variety of materials (metal, composites, and thermoplastics)
    • Resistant to temperatures up to 140°C
    • Extremely tenacious and resilient adhesive
    • Contains spacers to ensure a minimum bond line thickness of 0.05 mm
    • Rapid polymerization
    • Tenacious
    • Multipurpose
    • Excellent adhesion to a wide range of plastics, composites, and metals
    • Suitable for temperatures up to 100 °C
    • Excellent processing time/cure time ratio
    • Tenacious
    • Multipurpose
    • Tolerant to "suboptimal" pretreatment
    • Filling spaces up to 4 mm
    • Thixotropic, non-sagging
    • Tenacious and resilient adhesive
    • Suitable for bonding metals and composites
    • High resistance to weathering
    • Provides an adhesion thickness of 0.05 mm
    • Gel
    • Good bonding characteristics on a variety of plastics and materials
    • Filler up to 8mm
    • Tough flexible adhesive suitable for dynamic stresses
    • Two-component epoxy adhesive
    • Low-viscosity system
    • Good substrate wetting
    • Room temperature curing
    • Cures at room temperature
    • High strength and toughness
    • Thixotropic
    • Good environmental and chemical resistance
    • Metal bonding
    • Bonding of commonly used materials
    • Thixotropic, non-sagging
    • Tenacious and resilient adhesive
    • Suitable for bonding metals and composites
    • High resistance to weathering
    • Provides an adhesion thickness of 0.05 mm
    • Tenacious
    • Ideal for bonding GRP, SMC and dissimilar substrates
    • Fills in gaps, does not drip up to 10 mm thick
    • Good resistance to weathering
    • Resistance to high temperatures
    • Resistant to chemicals
    • Water resistant
    • Resistant to chemicals
    • It fills the games
    • It does not drip down to 5 mm
    • High shear strength
    • Paste a wide variety of materials (metal, composites, and thermoplastics)
    • Resistant to temperatures up to 140°C
    • Extremely tenacious and resilient adhesive
    • Contains spacers to ensure a minimum bond line thickness of 0.05 mm
    • High resistance to cutting and peeling
    • Paste a wide variety of materials (metal, composites, and thermoplastics)
    • Good resistance to moisture
    • Extremely tenacious and resilient adhesive
    • Long service life, ideal for assemblies of large composite parts
    • Contains spacers to ensure a minimum bond line thickness of 0.05 mm
    • Rapid polymerization
    • Tenacious
    • Multipurpose
    • Excellent adhesion to a wide range of plastics, composites, and metals
    • Suitable for temperatures up to 100 °C
    • Excellent processing time/cure time ratio
    • Tenacious
    • Multipurpose
    • Tolerant to "suboptimal" pretreatment
    • Filling spaces up to 4 mm
    • Hardens in 5-10 minutes
    • Elongation > 200 %
    • Absorbs shock and vibration
    • High resistance to peeling
    • Bonding a wide range of materials including glass
    • Translucent, low efflorescence
    • Gel consistency for precise application
    • Non-drip for vertical applications