Bonding composites and dissimilar substrates

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    • Two-component toughened epoxy adhesive
    • High toughness for durable and resilient joints
    • Resistant to dynamic loads and vibrations
    • Particularly suitable for bonding GRP, SMC, and dissimilar materials
    • Good resistance to environmental conditions
    • Thixotropic and sag-resistant
    • High gap-filling properties
    • Formulated without intentionally added BPA
    • Not subject to CMR labeling
    • Flexible epoxy structural adhesive
    • High shear and peel strength
    • Gap-filling with thixotropic behavior
    • Polymerization at room temperature
    • Good performance retention after environmental aging
    • 1:1 mixing ratio by weight and volume
    • SVHC-free according to REACH