Electronic Components
Showing all 8 results
Filtri
Tipo di prodotto
- 1 Electronics adhesive
- 1 Heat-conductive adhesive
- 4 Resins and encapsulants
- 2 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- Low viscosity casting resin
- High possibility of adding filler
- Encapsulation of electronic and low-voltage components
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- Not smooth
- Moderate thermal conductivity
- Does not require ovens or curing
- Heat flow away from circuit components can increase reliability
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- Hot polymerization
- High tensile strength
- Single component - Does not require mixing
- Fast and versatile curing with heat input fill or self-leveling after deployment
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- Moderate thermal conductivity
- One part: no ovens or curing required
- Pulls heat away from critical components
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- Adhesion to a wide variety of substrates
- Good adhesion, even under difficult conditions
- The changeable mixing ratio for varying flexibility
- Good electrical properties
- Used as an adhesive or encapsulant
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- Thermally conductive epoxy
- Easy to mix
- Uses non-abrasive fillers
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- Increased adhesion strength
- Can be used as a sealant or thermal adhesive
- High thermal conductivity
- Combines adhesive and heat dissipation properties
- Very wide operating temperature range
- Single-component
- Not lumpy
- Ideal if high viscosity product required
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- Soft, reworkable resin
- It can be "dug out"
- Flexible even in extreme temperatures
- Ideal for prototype circuits
- Replacement of silicone and control unit
