Electronic modules
Showing all 5 results
Filtri
Tipo di prodotto
- 3 Electronics adhesive
- 1 Heat-conductive adhesive
- 1 Resins and encapsulants
Marchio
Tecnologia
Applicazioni
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- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
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- Rapid polymerization in RT
- Mellow
- High elongation
- Controlled volatility of silicone
- Single-component - No mixing required
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- Volatility-controlled silicone
- Polymerizes into a soft and elastic elastomer
- No solvent added
- Single-component - No mixing required
- Polymerization at room temperature
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- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability
