Electronic modules

Showing all 6 results

Text search

Tipo di prodotto

Tipo di prodotto

Marchio

Tecnologia

Tecnologia

Applicazioni

Applicazioni

The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

Read more Quick View
DOWSIL™ 5515
- Low density
- Room temperature or heat-accelerated polymerization
- Non-sagging, stable even on vertical surfaces
- Soft and deformable material with stress relief function
- Slightly tacky surface after curing
- No exotherm during curing
Read more Quick View
DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
Read more Quick View
DOWSIL™ SE 9120 S
- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
Read more Quick View
DOWSIL™ SE 9185
- Rapid polymerization in RT
- Mellow
- High elongation
- Controlled volatility of silicone
- Single-component - No mixing required
Read more Quick View
DOWSIL™ SE 9186 Sealant
- Volatility-controlled silicone
- Polymerizes into a soft and elastic elastomer
- No solvent added
- Single-component - No mixing required
- Polymerization at room temperature
Read more Quick View
DOWSIL™ TC-5622 Thermally Conductive Compound
- Solvent-free formulation
- Easy application
- Low thermal resistance
- High thermal conductivity
- Good stability and reliability