Heatsinks
Showing all 5 results
Filtri
Tipo di prodotto
- 1 Electronics adhesive
- 1 Gap filler
- 1 Heat-conductive adhesive
- 1 Resins and encapsulants
- 1 Thermal conductive paste
Marchio
Tecnologia
Applicazioni
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- Fluid
- Hot polymerization
- Good thermal conductivity values
- No solvent added
- Single-component - No need to mix separate components
- Fast and versatile polymerization controlled by temperature
- Fills and self-levels after dispensing
- Heat dissipation from PCB systems to increase reliability
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No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)
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- Mixing ratio mixture 1:1
- Thermally conductive silicone
- Platinum curing system
- Polymerization at room temperature
- Provides long-term stability
- Polymerizes without exothermia
- Thixotropic, non-sagging
- Resistant to ozone and ultraviolet degradation
- Provides high cooling performance
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- Flame retardant
- Uses nonabrasive fillers
- Used for encapsulation of PCBs.
- Suitable for effective heat dissipation
- Provides environmental protection
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- Increased adhesion strength
- Can be used as a sealant or thermal adhesive
- High thermal conductivity
- Combines adhesive and heat dissipation properties
- Very wide operating temperature range
- Single-component
- Not lumpy
- Ideal if high viscosity product required
