Potting

    • When properly mixed, the gel is green
    • Conditional adhesion without primer at room temperature
    • Hardened gel for increased mechanical strength
    • UV indicator enables automatic inspection
    • Increased flame resistance
    • Slow-curing two-component silicone dielectric gel
    • Good flame resistance
    • Good mechanical strength
    • Contains UV indicator for inspection
    • Adhesion without the use of primer
    • Cures extremely softly
    • Designed to insulate circuits from the damaging effects of moisture
    • Provides electrical insulation for high voltages
    • Protects circuits and interconnections from thermal stresses
    • Low viscosity
    • Odorless
    • UV curing in 1 part
    • Very soft
    • Suitable for very low temperatures
    • Does not require mixing
    • UV rays for fast processing speed
    • Polymerization secondary to moisture
    • The gel remains flexible even at very low temperatures
    • Rapid polymerization
    • Suitable for very low temperatures
    • Rapid thermal polymerization to speed up processing
    • Gel remains flexible in ultra-low temperature applications
    • Rapid polymerization
    • Very low viscosity
    • Controlled volatility of silicone
    • Solvent-free
    • Excellent smoothness, filling or self-leveling after distribution
    • Polymerizes into a soft, low-stress elastomer
    • Coating can improve reliability against stresses
    • Two-component thermal conductive encapsulant
    • Suitable for PCB system
    • Protection in harsh environmental and thermal conditions
    • Can be used at room temperature
    • Used in the production of electrical products, PCBs and modules
    • Good adhesion to aluminum
    • Excellent dielectric properties
    • Good smoothness
    • Easy dispensing
    • Good flexibility for easy processing
    • Good adhesion without the use of primer
    • Mixing ratio 1 to 1
    • Sliding
    • Self-priming
    • No further priming is necessary
    • Fast and versatile polymerization controlled by temperature
    • Fluidity and filling in confined spaces and around complex geometries
    • Good dielectric properties