Printed circuit board PCB

Showing 21–40 of 40 results

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DOWSIL™ CC-3122 Conformal Coating
- One-component silicone conformal coating
- Translucent
- Low viscosity
- Moisture cure (RTV)
- Solvent-free
- Provides environmental resistance
- Dielectric protection
- Long-term reliability even in harsh environmental conditions
- UL recognized and includes a UV indicator for coating inspection.
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DOWSIL™ EA-9189 H White RTV Adhesive

No mixing required No reaction exotherm during curing Excellent primerless adhesion on many substrates Excellent performance across a wide temperature range Cures into soft, low-stress elastomers Controlled volatility (controlled silane migration)
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DOWSIL™ EE-3200 Low Stress Silicone Encapsulant
- Reduces pressure on components
- Effectively dissipates heat
- Avoids delamination problems
- The rapid polymerization
- Optimized processing time
- Allows for the implementation of complex projects
- No additional dielectric barrier required
- Allows for quick filling
- It is suitable for high-throughput production processes.
- Filling allows easy control of the process
- Meets certification requirements
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DOWSIL™ EG-1200 Gel
- Gel is a two-component addition-cure silicone gel
- Clear and flowable,
- Designed for optically clear potting and coupling applications in displays and LED lighting systems.
- High transparency
- Reduced yellowing
- High surface adhesion
- Good stress absorption capacity
- Provides mechanical protection, electrical insulation and long-term reliability.
- Can cure at room temperature or with thermal acceleration.
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DOWSIL™ EI -2888 Primerless Silicone Encapsulant Kit
- Polymerization at room temperature
- Low viscosity - ease of processing
- Self-adhesive - no primer required
- Reliable optical performance in difficult conditions
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DOWSIL™ Q3-6575 Dielectric Gel A/B Kit
- Rapid polymerization
- Suitable for very low temperatures
- Rapid thermal polymerization to speed up processing
- Gel remains flexible in ultra-low temperature applications
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DOWSIL™ SE 1700 Adhesive
- Mellow
- Two-component - 10:1 mixing ratio
- High tensile strength
- Good processing time after mixing
- Hot polymerization
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DOWSIL™ SE 4420
- Polymerization at room temperature
- Good adhesion on various substrates
- Fast tack-free time
- Elastomeric material with high elongation
- Suitable for bonding, sealing and thermal dissipation
- Good mechanical strength
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DOWSIL™ SE 9120 S
- Rapid polymerization in RT
- Low viscosity
- Controlled volatility of silicone
- No solvent added
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DOWSIL™ SE 9157 Conformal Coating
- Rapid polymerization in RT, without notches
- Medium viscosity
- Polymerizes into a soft, low-stress elastomer
- Without added solvents
- Slight thermal acceleration can speed up in-line processing
- Soft coating can improve reliability against stresses
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DOWSIL™ SE 9185
- Rapid polymerization in RT
- Mellow
- High elongation
- Controlled volatility of silicone
- Single-component - No mixing required
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DOWSIL™ SE 9186 Sealant
- Volatility-controlled silicone
- Polymerizes into a soft and elastic elastomer
- No solvent added
- Single-component - No mixing required
- Polymerization at room temperature
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DOWSIL™ SE 9187 L Adhesive
- Rapid polymerization
- Very low viscosity
- Controlled volatility of silicone
- Solvent-free
- Excellent smoothness, filling or self-leveling after distribution
- Polymerizes into a soft, low-stress elastomer
- Coating can improve reliability against stresses
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DOWSIL™ SE 9188 RTV Adhesive
- Mellow
- Controlled volatility of silicone
- Single-component - No mixing required
- Polymerization at room temperature
- Self-extinguishing UL94 V-0
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DOWSIL™ TC-4525 CV Thermally Conductive Gap Filler
- Polymerization at room temperature
- Long-term performance stability up to 150°C
- Low compression stress
- Maintains upright position (cured or uncured state)
- Controlled volatility of silicone
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DOWSIL™ TC-5121C LV Thermally Conductive Compound
- Polymer matrix helps reduce pump out
- Fluid
- Good thermal conductivity
- Low thermal resistance
- Does not polymerize
- Heat removal from PCB system components
- Possible to obtain bond line thickness (BLT).
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Electrolube DCR SCC3
- Minimizes circuit board design
- High resistance to chemicals and solvents
- Extremely wide operating temperature range
- Resistant to solvents in aerospace and automotive industries
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Electrolube FSC Flexible Silicone Coating
- High resistance to surface insulation
- Good resistance to wet environments
- Flexible coating
- Good resistance to a wide and variable temperature range
- Ideal for applications requiring rework
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Electrolube UR5608 Polyurethane Resin
- Semi-rigid polyurethane resin
- Exceptional toughness
- Excellent adhesion
- Excellent chemical resistance
- Effective potting
- Low water absorption
- Good electrical properties
- Quick-cure version available
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SYLGARD™ 527 A&B Silicone Dielectric Gel
- Seals and protects PCBs and electronic devices
- Used for delicate electrical devices
- Offers excellent flexibility
- Cures even at room temperature
- Isolate circuits from harmful effects
- Special class of encapsulants
- Polymerizes into an extremely soft material
- Protects circuits and interconnections
- Operational over a wide temperature range