Printed circuit board PCB

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The data on this page are to be considered purely indicative and do not constitute a technical data sheet.

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DOWSIL™ 1-2577 Conformal Coating
- Cures to an elastoplastic surface
- Resilient and abrasion resistant
- Single-component solvent-based resin coating
- Polymerization at room temperature
- It can speed up in-line processing
- UV indicator enables automatic inspection
- Allows use with many low-solids lead-free solder
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DOWSIL™ 1-2620 Dispersion RTV Elastoplastic Conformal Coating
- Cures to a robust surface
- Resilient and abrasion resistant
- Solvent-based resin coating
- Polymerization at room temperature
- Possibility of acceleration after solvent spillage
- UV indicator for inspection
- Allows use with many low-solids lead-free solder
- Low viscosity improves flow and
- fill tight spaces and gaps
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DOWSIL™ 1-2620 Low VOC Conformal Coating
- Medium viscosity
- Low VOC content
- Abrasion resistance
- Good dielectric properties
- Good adhesion to many substrates
- Polymerization at room temperature
- Stable and flexible over a wide temperature range
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DOWSIL™ 1-4173 Thermally Conductive Adhesive
- Fluid
- Hot polymerization
- Good thermal conductivity values
- No solvent added
- Single-component - No need to mix separate components
- Fast and versatile polymerization controlled by temperature
- Fills and self-levels after dispensing
- Heat dissipation from PCB systems to increase reliability
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DOWSIL™ 3-1944 RTV Coating
- Single-component, does not require mixing
- Good fluidity
- After dispensing, it is capable of flowing, filling or self-leveling
- Faster inline machining with optional thermal acceleration
- No solvent added
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
- UV indicator enables automatic inspection
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DOWSIL™ 3-1953 Conformal Coating
- No solvent added
- Polymerization at room temperature
- Slight thermal acceleration can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Soft coating improves reliability against stresses
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DOWSIL™ 3-1965 Conformal Coating
- No solvent added
- Polymerization at room temperature
- It can speed up in-line processing
- Good adhesion to many substrates
- Allows use with many low-solids lead-free solder
- Improves reliability against stresses
- Promotes flow and filling of narrow spaces and crevices
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DOWSIL™ 3-4207 Dielectric Tough Gel Kit
- When properly mixed, the gel is green
- Conditional adhesion without primer at room temperature
- Hardened gel for increased mechanical strength
- UV indicator enables automatic inspection
- Increased flame resistance
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DOWSIL™ 3-6753 Thermally Conductive Adhesive
- Mixing ratio: 1 to 1
- Highly fluent
- Self-leveling
- Versatile thermal polymerization
- Ensures heat flow away from components
- With 7 mil glass microspheres
- Check the thickness of the adhesion line
- Without added solvents
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DOWSIL™ 3140 RTV Coating
- Single-component
- Does not require mixing
- Good fluidity
- Capable of flowing, filling or self-leveling
- Polymerization at room temperature
- No solvent added
- UV indicator for manual and automatic inspections
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DOWSIL™ 3145 RTV Mil-A-46146 Adhesive / Sealant
- Mellow
- High tensile strength and elongation resistance
- High thermal stability
- Single component - Does not require mixing
- Polymerization at room temperature
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DOWSIL™ 3165 Fast Tack RTV Adhesive Sealant
- Mellow
- Polymerization in rapid RTV
- Good "green" resistance
- Single-component - No mixing required
- Polymerization at room temperature
- Fast skin time
- High self-extinguishing
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DOWSIL™ 3810 EG
- One-part dielectric gel
- Transparent
- Hot polymerization
- Low viscosity
- Very soft gel
- Suitable for PCB potting and electronic component protection
- Electrical insulation and environmental protection
- Extended temperature range (-60°C / +200°C)
- No mixing required
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DOWSIL™ 5351
- Non-curing
- High thermal conductivity
- Stable on vertical surfaces
- Gap filling capacity up to 1.0 mm
- Thermally conductive silicone material
- Low thermal resistance and good high-temperature stability
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DOWSIL™ 5515
- Low density
- Room temperature or heat-accelerated polymerization
- Non-sagging, stable even on vertical surfaces
- Soft and deformable material with stress relief function
- Slightly tacky surface after curing
- No exotherm during curing
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DOWSIL™ 739 Plastic Adhesive
- Mellow
- High elongation by stress reduction
- Single-component - No mixing required
- Polymerization at room temperature
- High self-extinguishing
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DOWSIL™ 744 RTV Adhesive Sealant
- Cures at room temperature
- Pasty consistency
- It does not drip
- Easy to apply
- High elongation
- Stable and flexible over a wide temperature range
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DOWSIL™ CC 2588
- Medium viscosity
- Abrasion-resistant elastoplastic surface
- Solvent-based coating
- High solid content
- UV indicator for inspection
- Room temperature vulcanization (RTV)
- Good adhesion on rigid and flexible PCBs
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DOWSIL™ CC 8030 UV
- Low viscosity, spray applicable
- Fast UV cure with secondary moisture cure
- Solvent-free
- UV indicator for inspection
- Good adhesion to PCB materials
- Reduced oxygen inhibition
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DOWSIL™ EA-9189 H White RTV Adhesive

No mixing required No exotherm of reaction during curing Excellent adhesion without primer on many substrates Excellent performance over a wide temperature range Polymerizes into low-stress soft elastomers Controlled volatility (controlled migration of silanes)